Adhesive Sheet Wrinkling Control via Local UV Curing
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Solution Overview
Problem
Conventional methods for manufacturing electronic component supply bodies often result in wrinkled adhesive sheets, leading to random tilting of semiconductor chips and potential pickup failures during suction, due to uneven adhesive curing and contraction stress.
Innovation Solution
An electronic component supply body with an adhesive sheet featuring a UV-curing adhesive layer, a ring frame with an opening, and strategically positioned second cured portions along the ring frame's circumference to enhance shearing direction adhesive strength, preventing sheet wrinkling and pickup failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the adhesive sheet is irradiated with ultraviolet rays to cure the adhesive layer, then the electronic component chips can be easily separated from the adhesive sheet, but the adhesive sheet gets wrinkled and the chips tilt randomly
Solution Approach 1:
The patent applies local quality by creating different cured states in different regions of the adhesive sheet. The first region (chip mounting area) is fully cured to enable easy chip separation, while the second region (peripheral area) is intentionally left uncured or partially cured to maintain adhesive strength and prevent wrinkling. This spatial differentiation of curing states resolves the contradiction between easy chip separation and prevention of sheet deformation.
2Manufacturing precision
If the adhesive strength in the second region is increased to prevent wrinkling, then the adhesive sheet remains flat, but the electronic component chips cannot be easily separated
Solution Approach 1:
The patent segments the adhesive sheet into two functional regions: a first region for chip mounting where the adhesive is cured to enable separation, and a second peripheral region where the adhesive is uncured or partially cured to maintain sheet flatness through controlled adhesive strength. This segmentation allows each region to fulfill its specific function without interfering with the other, resolving the contradiction between maintaining flatness and enabling chip separation.
3Strength
If the adhesive layer is fully cured to ensure strong bonding, then the bonding strength is maximized, but the adhesive sheet wrinkles and chip pickup fails
Solution Approach 1:
The patent applies local quality by creating spatially differentiated curing states: the first region containing electronic component chips is fully cured to provide strong bonding and enable easy separation, while the second peripheral region is intentionally left uncured or partially cured to maintain flexibility and prevent wrinkling. This localized control of adhesive properties resolves the contradiction between maximizing bonding strength and preventing sheet deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses adhesive sheet wrinkling and ensures reliable chip pickup by maintaining strong adhesive strength in the shearing direction, preventing positional displacement and contraction-induced wrinkles, thus ensuring stable chip placement and retrieval.
Implementation Method 1
an adhesive sheet that has an adhesive layer formed with an ultraviolet-curing adhesive
Data Source
AI summary
An electronic component supply body and a method for manufacturing the same, which can suppress generation of wrinkles of an adhesive sheet and is unlikely to cause pickup failure of electronic component chips to occur. The supply body includes an adhesive sheet with an adhesive layer formed with an ultraviolet-curing adhesive, a ring frame bonded onto the adhesive sheet, and electronic component chips bonded onto a first region on the adhesive sheet superimposed with the opening of the ring frame. The second cured portions that are cured by being irradiated with ultraviolet rays are provided in a part of a second region forming a bonded portion between the adhesive sheet and the ring frame. Adhesive strength in the second cured portions in a shearing direction is larger than adhesive strength in a portion of the second region other than the second cured portions.