Adhesive-Solder Hybrid Bonding for Image Reading Apparatus Focus Stability
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Solution Overview
Problem
Conventional image reading apparatuses face issues with focus variation and image degradation due to the lack of strength in adhesives and the inefficiency of soldering, particularly with increased pixel density in solid-state image sensors, where adhesive volume contraction causes defocusing and requires skilled labor.
Innovation Solution
The use of a combination of adhesive and solder for fixing the substrate holding member and imaging lens holding member, where the adhesive is initially used for focus adjustment and then solder is applied to secure the bond, reducing focus displacement and enhancing stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If adhesive is used for fixing the substrate holding member and imaging lens holding member, then assembly efficiency is improved and automation is enabled, but bonding strength is insufficient and focus stability deteriorates due to volume contraction during hardening
Solution Approach 1:
The patent combines two different bonding methods (adhesive bonding and soldering) into a unified fixing structure. The substrate holding member is fixed to the imaging lens holding member using both adhesive and solder, merging the advantages of both methods: adhesive provides automated assembly and initial positioning, while solder provides strong bonding and thermal compensation during curing
Solution Approach 2:
The patent uses a composite bonding approach by applying both adhesive material and solder material to the same bonding interface. This composite fixing structure leverages the complementary properties of adhesives (automation, flexibility) and solder (strength, rigidity, thermal expansion matching) to resolve the contradiction between assembly efficiency and bonding strength
2Strength
If solder is used for fixing the substrate holding member and imaging lens holding member, then bonding strength is sufficient, but assembly efficiency deteriorates due to requirement of skilled workers and risk of displacement during soldering
Solution Approach 1:
The patent applies adhesive bonding before soldering to pre-fix the substrate holding member to the imaging lens holding member. This preliminary action with adhesive enables automated assembly and positions the components correctly before the soldering process, preventing displacement during soldering and eliminating the need for skilled manual intervention
Solution Approach 2:
The adhesive acts as an intermediary that facilitates the soldering process. By providing initial bonding and positioning, the adhesive enables subsequent soldering to be performed more easily and reliably, bridging the gap between automated assembly requirements and the need for strong bonding
3Extent of automation
If adhesive is used for fixing, then assembly automation is enabled, but manufacturing precision deteriorates due to volume contraction during hardening causing focus variation
Solution Approach 1:
The patent converts the harmful volume contraction of adhesive during hardening into a beneficial process by performing soldering after adhesive application. The soldering step compensates for and corrects the focus shift caused by adhesive contraction, transforming the harmful effect into an opportunity for final precision adjustment
Solution Approach 2:
The patent changes the physical state and bonding characteristics of the fixing system through a two-stage process: first using adhesive in a flexible state for automated positioning, then applying solder to achieve final rigid bonding. This parameter change from flexible to rigid bonding allows both automation and precision to be achieved at different stages
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method minimizes focus variation and image degradation by stabilizing the sensor-lens alignment, improving assembly efficiency and preventing displacement during soldering, while ensuring sufficient bonding strength and reduced thermal impact.
Implementation Method 1
the substrate holding member and the imaging lens holding member are fixed using an adhesive and solder
Implementation Method 2
the substrate holding member and the imaging lens holding member are fixed using an adhesive and solder
Implementation Method 3
an imaging lens configured to form an image of light from the document on the sensor
Data Source
AI summary
A document reading apparatus includes a sensor configured to receive light from a document, an imaging lens configured to form an image of light from the document on the sensor, a first holding member to which the imaging lens is fixed, and a second holding member to which the sensor is fixed, wherein the first holding member and the second holding member are fixed using an adhesive and solder.