Adhesive Composition for Solder Precoat Oxide Suppression
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Solution Overview
Problem
The miniaturization of electronic components leads to finer solder precoats, which are susceptible to oxide film formation, causing poor connections between electrodes and components, and existing methods to suppress oxide film formation can inadvertently cause poor connections.
Innovation Solution
An adhesive is used to temporarily fix electronic components to solder precoats covered partially with an organic film, containing a solvent that dissolves the organic film during reflow, ensuring sufficient adhesiveness and preventing oxide film formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the solvent content in the adhesive is increased to dissolve the organic film during reflow, then the organic film dissolves effectively, but the adhesiveness may be reduced
Solution Approach 1:
The patent optimizes the solvent content parameter within the specific range of 25-40 mass% to achieve the right balance. This parameter setting ensures sufficient solvent is present to dissolve the organic film during reflow while maintaining adequate adhesiveness for temporary bonding. The patent also specifies the principal resin content (60-70 mass%) to complement the solvent and provide the necessary adhesive strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive effectively suppresses oxide film formation on solder precoats, ensuring stable connections between electrodes and components, particularly for miniature components, by dissolving the organic film during reflow.
Implementation Method 1
the organic film dissolves in the solvent when the solder precoat is melted
Implementation Method 2
applying an adhesive for temporarily fixing an electronic component on the solder precoat
Implementation Method 3
reflowing the solder precoat, to mount the electronic component on the circuit member
Data Source
AI summary
An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. The content of the solvent is 25 mass % or more and 40 mass % or less, and the organic film dissolves in the solvent when the solder precoat is melted. According thereto, the formation of an oxide film on the surface of the solder precoat can be suppressed, and poor connection between the electrode having the solder precoat and the electronic component can be suppressed.