Adhesive Structure Dismantling With Dielectric Heating

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for dismantling adherends that are firmly bonded using dielectric heating fail to provide easy separation, as the adherends are strongly bonded, making disassembly difficult, especially in industrial applications like automobile parts.

Innovation Solution

A method involving a dielectric adhesive sheet with a thermoplastic resin and dielectric filler, heated by dielectric heating and separated using external forces, such as shear, out-of-plane, peeling, and suction forces, along with high-frequency voltage application, to facilitate separation of adherends.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a dielectric adhesive sheet with thermoplastic resin and dielectric filler is used to firmly bond adherends through dielectric heating, then bonding strength is improved, but ease of dismantling deteriorates

Engineering Contradiction:
Improvebonding strengthVSAvoidease of dismantling
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The invention changes the physical state of the dielectric adhesive sheet by controlling the phase transition temperature of the thermoplastic resin. By selecting resins with specific melting points (80-200°C) and controlling heating parameters during dismantling, the adhesive transitions from a solid bonded state to a melted separable state, resolving the contradiction between strong bonding and easy dismantling.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention employs periodic heating cycles: first heating to bond the adherends firmly, then applying heat again during dismantling to melt the adhesive and enable separation. This periodic thermal action allows the adhesive to alternately provide strong bonding and easy separation at different stages.

Inventive Principle:
Principle #19Periodic action

2Reliability

If high-frequency voltage is applied for extended periods to ensure complete heating and separation, then separation completeness is improved, but processing time increases

Engineering Contradiction:
Improveseparation completenessVSAvoidprocessing time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The invention performs preliminary heating to melt the thermoplastic resin before applying separation forces. By pre-heating the adhesive sheet to its melting point range, the material becomes sufficiently soft and separable, allowing complete separation to be achieved quickly without requiring extended high-frequency voltage application.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention replaces purely mechanical separation forces with thermal energy input. Instead of applying excessive mechanical force to separate firmly bonded adherends, the process uses dielectric heating to melt the thermoplastic adhesive, enabling separation through thermal softening rather than mechanical force alone.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively separates firmly bonded adherends by dielectric heating and external forces, allowing for efficient dismantling of industrial waste components like automobile parts without excessive force or time.

Implementation Method 1

a first step of heating the dielectric adhesive sheet by dielectric heating

Methodology Applied
Scientific EffectDielectric heating: Dielectric Heating

Data Source

PatentEP3666838B1Method for dismantling adhesive structure
Publication Date: 2025.10.01 LINTEC CORP
  • EP3666838B1 patent drawingFigure 1
  • EP3666838B1 patent drawingFigure 2
  • EP3666838B1 patent drawingFigure 3

AI summary

The invention provides a method of dismantling an adhesion structure (1) including a pair of adherends (2, 3) made of the same material or different materials and a dielectric adhesive sheet (4) interposed between the pair of adherends (2, 3) and bonding the pair of adherends (2, 3) to each other. The method includes: a first step of heating the dielectric adhesive sheet (4) by dielectric heating; and a second step of applying an external force to at least one of the pair of adherends (2, 3) or the dielectric adhesive sheet (4) to separate the pair of adherends (2, 3) from the dielectric adhesive sheet (4).