Adhesive Structure for Foldable Display Stress Distribution
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Solution Overview
Problem
Foldable electronic devices face stress distortion and damage due to relative movement and external impacts, which are transferred to the display module through conventional adhesive structures, leading to potential damage to the light emitting layer and adhesive force degradation.
Innovation Solution
An adhesive structure with non-overlapping patterns of adhesive layers on both sides of a substrate is used to distribute stress between the foldable housing and the display module, preventing shear behavior and maintaining adhesive force by allowing deformation and distributing stress through compression and tension.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional adhesive structure is used to couple the foldable housing and display module, then the housing structures can be bonded to the display module, but stress from relative movement and external impacts is transferred to the display module causing damage to the light emitting layer
Solution Approach 1:
The adhesive structure is divided into a first adhesive layer and a second adhesive layer with non-overlapping patterns on opposite sides of the substrate. This segmentation allows stress to be distributed across multiple discrete bonding points rather than concentrated across the entire adhesive area, protecting the display module from stress transfer during foldable housing movement and impact events.
Solution Approach 2:
The substrate acts as an intermediary element between the foldable housing and the display module. The non-overlapping adhesive layers on the substrate create a decoupling effect that allows the housing to move relative to the display module while maintaining bonding, thereby preventing direct stress transfer to the vulnerable light emitting layer.
2Strength
If the adhesive structure uses overlapping adhesive patterns on both sides of the substrate, then strong bonding is achieved, but shear behavior occurs during relative movement causing adhesive force degradation
Solution Approach 1:
The adhesive bonding is segmented into non-overlapping first and second adhesive layers on opposite sides of the substrate. This segmentation prevents the formation of continuous shear paths that would occur with overlapping patterns, allowing the adhesive structure to accommodate relative movement without degrading adhesive force.
Solution Approach 2:
The adhesive layers are positioned with specific non-overlapping local patterns optimized for their respective sides. The first adhesive layer pattern on one side of the substrate does not overlap with the second adhesive layer pattern on the opposite side, creating localized bonding zones that maintain stability during relative movement while preserving overall adhesive strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces stress on the display module, preventing damage and maintaining adhesive force, as demonstrated by reduced stress concentrations and strain distribution in comparative tests.
Implementation Method 1
distributing stress through compression and tension
Implementation Method 2
distributing stress through compression and tension
Implementation Method 3
allowing deformation and distributing stress
Data Source
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AI summary
An electronic device is provided. The electronic device includes a foldable housing, a flexible display module, a first adhesive structure, and a second adhesive structure. The foldable housing may include a hinge structure, a first housing structure, and a second housing structure. The flexible display module may be extended from the first surface to the third surface, and include a fifth surface facing the first surface, and a sixth surface facing the third surface. The first adhesive structure may be disposed between the first surface and the fifth surface, and include a first substrate, a first adhesive layer, and a second adhesive layer. The second adhesive structure may be disposed between the third surface and the sixth surface, and include a second substrate, a third adhesive layer, and a fourth adhesive layer.