Adhesive Substrate Carrier for Vertical ALD Processing

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Solution Overview

Problem

Prior art gas deposition apparatuses face challenges in efficiently placing substrates in a vertical position and preventing backside deposition, with existing solutions being cumbersome and expensive.

Innovation Solution

A substrate is detachably attached to a support using an adhesive, allowing for easy vertical positioning and preventing backside deposition by using an adhesive layer that attaches the substrate tightly to the support, thereby simplifying the loading process and avoiding complex support structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If substrates are placed in vertical position using prior art substrate supports, then the substrate can be processed in vertical position, but the placement process becomes cumbersome and complicated

Engineering Contradiction:
Improveease of substrate placementVSAvoidcomplexity of substrate support
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical substrate support structures with a chemical bonding mechanism. An adhesive layer is applied to the substrate support, creating a simple chemical bond that automatically holds the substrate in vertical position without requiring complicated mechanical gripping or positioning mechanisms. This substitution dramatically simplifies both the support structure and the substrate placement operation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If prior art substrate supports are used to hold substrates, then substrates can be supported during processing, but backside deposition occurs on the substrate

Engineering Contradiction:
Improvesubstrate support reliabilityVSAvoidbackside deposition
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The adhesive layer is applied selectively only to the specific region of the substrate support that contacts the substrate's backside surface. This localized application provides support exactly where needed while leaving the rest of the substrate accessible to the deposition process. The adhesive's selective placement prevents harmful backside deposition while maintaining reliable substrate support during processing.

Inventive Principle:
Principle #3Local quality

3Object-generated harmful factors

If complicated solutions like porous pieces or planar carriers are used to prevent backside deposition, then backside deposition is reduced, but the device becomes more complex and expensive

Engineering Contradiction:
Improvebackside deposition preventionVSAvoidcomplexity of prevention mechanism
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The adhesive layer functions as a temporary, consumable element that performs its prevention function during the deposition process and can be easily removed or replaced. This disposable adhesive approach is much simpler and less expensive than permanent mechanical structures like porous pieces or precision planar carriers. The adhesive achieves backside deposition prevention without requiring complex, expensive, or difficult-to-maintain device components.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables easy and simple attachment of substrates in vertical positions within the reaction chamber while preventing backside deposition, eliminating the need for complicated support solutions and reducing costs.

Implementation Method 1

a substrate is arranged to be detachably connected to the substrate support by means of an adhesive

Methodology Applied
Scientific EffectAdhesive: Adhesive

Data Source

PatentEP2435597B1Arrangement for processing substrate and substrate carrier
Publication Date: 2018.10.17 BENEQ OY

AI summary

The invention relates to an arrangement for processing a substrate in a reaction chamber of a gas deposition apparatus by exposing the substrate to alternate, saturated surface reactions of starting materials, the arrangement comprising loading means for loading the substrate into the reaction chamber on a substrate support. In accordance with the invention, the substrate is arranged for being attached in a detachable manner with an adhesive to the substrate carrier.