Adhesive Substrate Clamping for Flatness and Thermal Expansion
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Solution Overview
Problem
Existing substrate clamping technologies for semiconductor lithography face challenges such as electrostatic interference, complexity, and difficulty in scaling to different substrate dimensions, particularly in maintaining surface flatness and accommodating thermal expansion during charged particle beam lithography.
Innovation Solution
A method and system using adhesive material to clamp substrates with a plurality of support locations, allowing for thermal expansion and maintaining surface flatness, which involves applying adhesive material on a support surface, positioning the substrate, and curing the adhesive to form a clamp with a low adhesive force that can be easily broken for unclamping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If electrostatic clamping is used to clamp substrates, then clamping force is achieved, but electrostatic interference and wiring complexity occur that disturb charged particle beam paths and stage movement
Solution Approach 1:
The patent replaces electrostatic clamping with a mechanical clamping system using a clamp structure that applies direct mechanical force to hold the substrate. This eliminates the need for electrical wirings and power sources, removing electrostatic interference with charged particle beams while achieving reliable clamping force through purely mechanical means.
2Manufacturing precision
If capillary clamping is used to clamp rigid substrates, then positioning accuracy and heat transfer are improved, but system complexity and clamping time increase
Solution Approach 1:
The patent extracts and eliminates the complex capillary structure from the clamping system, replacing it with a simple mechanical clamp that achieves positioning accuracy through direct mechanical contact and force application. This removes the need for capillary channels and complex fluid management systems while maintaining substrate positioning precision.
3Temperature
If capillary clamping is used to accommodate thermal expansion, then heat transfer is improved, but clamping time and system complexity increase
Solution Approach 1:
The patent replaces the capillary-based thermal management system with a direct mechanical clamping structure that accommodates thermal expansion through elastic deformation of the clamp components. This eliminates time-consuming capillary filling operations while providing adequate heat transfer through thermal contact between the substrate and clamp surfaces.
4Manufacturing precision
If adhesive material is used to clamp substrates, then surface flatness and thermal expansion accommodation are improved, but adhesive strength may be insufficient for high precision applications
Solution Approach 1:
The patent employs a composite clamping system where adhesive material is applied in specific patterns or locations rather than uniformly across the substrate. This combines the flatness-accommodating properties of adhesives with strategically placed mechanical support points, creating a composite system that maintains surface flatness while providing sufficient localized strength for high precision lithography applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable, quick, and cost-effective method for clamping substrates with high accuracy and flatness, minimizing thermal bow and vibrations, and enabling easy unclamping without damaging the substrate, while accommodating thermal expansion and varying substrate dimensions.
Implementation Method 1
applying adhesive material on portions of the first surface, placing the substrate onto the adhesive material, such that the adhesive material forms a plurality of support locations supporting the substrate
Implementation Method 2
the adhesive material forms a plurality of support locations supporting the substrate
Data Source
AI summary
Methods and arrangement for clamping substrates to a support using adhesive material area disclosed.The method comprises providing a support comprising a first surface defining a plane; applying adhesive material on at least portions of the first surface; and placing the substrate onto the adhesive material, wherein the adhesive material forms a plurality of support locations supporting the substrate. Preferably the adhesive material is cured at least partly during the application of a substantially uniformly distributed force to the substrate in the direction of the support.The arrangements comprise a support comprising a first surface, for supporting the substrate via adhesive material, whereby the first surface defines a plane. Preferably it also comprises an arrangement for providing electromagnetic radiation, thermal energy, and/or a chemical substance to the adhesive material, and an arrangement for providing a substantially uniformly distributed force to the substrate in the direction of the support.