Adhesive Substrate Handling Device for Vacuum Dust Prevention
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Solution Overview
Problem
The existing handling devices for substrates in OLED panel manufacturing are unable to prevent dust from adhering due to Brownian motion when attaching sucking discs in vacuum chambers, leading to increased transportation time and decreased manufacturing efficiency.
Innovation Solution
A handling device with a holder, movable element, and adhesive chucks that can be attached and detached in a vacuum chamber to prevent dust adherence, allowing for enhanced substrate support and reduced risk of dropping, enabling processing within a single chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sucking disc combination is used to support the substrate, then the substrate can be stably carried, but the sucking disc combination cannot be attached in the vacuum chamber because it requires air pressure difference to produce suction force
Solution Approach 1:
The patent replaces the air pressure-based suction mechanism with a direct mechanical adhesion mechanism. The adhesive chuck uses adhesive material that directly bonds to the substrate surface through contact, eliminating the need for air pressure differential. This allows the chuck to be attached and detached within the vacuum chamber environment while maintaining reliable substrate holding.
2Adaptability or versatility
If the substrate is transported to several chambers for processing, then the substrate can be handled in different environments, but the transportation time is increased and manufacturing efficiency is decreased
Solution Approach 1:
The adhesive chuck is designed with universal applicability to work in various vacuum chamber environments. It can be attached to the substrate once and maintain holding through multiple processing steps within the same vacuum chamber, eliminating the need to transport the substrate between multiple chambers for different handling operations. This multi-functional capability improves manufacturing efficiency while maintaining processing adaptability.
3Reliability
If the sucking disc combination is attached on the substrate in the chamber filled with air, then the substrate can be supported, but dust drifts and adheres on the substrate owing to Brownian motion
Solution Approach 1:
The adhesive chuck attachment process is designed to occur within the vacuum chamber environment rather than in air. By performing the attachment operation in the vacuum (inert) atmosphere, dust particles are prevented from drifting and adhering to the substrate during the chuck attachment process. The adhesive material bonds the chuck to the substrate in a dust-free vacuum environment, eliminating the harmful dust adherence effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively prevents dust adherence and reduces the need for multiple chambers, thereby decreasing costs and transportation time, enhancing manufacturing efficiency by maintaining substrate stability during processing.
Implementation Method 1
a handling device for handling a substrate, the handling device includes a holder, a movable element, at least one first adhesive chuck, and at least one second adhesive chuck
Data Source
AI summary
A handling device is used for handling a substrate. The handling device includes a holder, a moving element, at least one first adhesive chuck, and at least one second adhesive chuck. The moving element is located adjacent to the holder for moving relative to the holder along a first axial direction. The first adhesive chuck is located on a first surface of the holder and the second adhesive chuck is located on a first surface of the moving element, in which the first adhesive chuck and the second adhesive chuck are used to be respectively separated from the substrate adhered thereon. In addition, another embodiment of the invention discloses a handing method of the handing device.