Adhesive Substrate with Curved Contact for Microchip Transfer
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Solution Overview
Problem
Existing methods for downsizing semiconductor chips, such as flip chip bonding and anisotropic conductive films, face challenges in efficiently picking up and transferring large amounts of fine chips and particles due to complex processes and high costs, particularly in preventing static electricity-induced failures and uneven particle distribution.
Innovation Solution
An adhesive substrate with a recessed and projected pattern on a support base member containing electroconductive particles and an insulating resin, where the adhesive layer is applied only on the upper surfaces of the projected portions with a curved surface, allowing for selective and rapid transfer of fine chips and particles while minimizing static electricity issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a flat-surface adhesive layer is used to pick up chips, then the contact area with chips is large, but it becomes difficult to transfer all chips completely to a different adhesive substrate and the process becomes complicated
Solution Approach 1:
The adhesive layer is segmented into multiple independent adhesive regions corresponding to the recessed and projected pattern, where each projected portion forms a discrete adhesive contact point. This segmentation allows individual chip pickup and transfer without interference, solving the problem of incomplete transfer and process complexity while maintaining sufficient contact area through the distributed adhesive regions.
Solution Approach 2:
The adhesive layer exhibits local quality variations through the recessed and projected pattern, with adhesive material concentrated on the projected portions that contact the chips. This creates localized adhesive zones with different properties (adhesive concentration, contact pressure) in different regions, enabling selective and complete chip transfer while simplifying the overall process.
2Manufacturing precision
If chips are picked up one by one using conventional methods, then individual placement is possible, but it takes quite a long time for die bonding of large amounts of very small chips
Solution Approach 1:
The adhesive layer is pre-configured with a recessed and projected pattern that corresponds to the chip arrangement before pickup. This preliminary configuration allows multiple chips to be picked up simultaneously in their correct positions, maintaining individual placement precision while dramatically increasing transfer speed by processing multiple chips in parallel rather than sequentially.
3Manufacturing precision
If pressure is reduced on one side of a porous plate to capture electroconductive particles, then particle transfer is achieved, but the number of steps increases and cost increases extremely
Solution Approach 1:
The support base member with recessed and projected pattern serves multiple functions simultaneously: it provides the adhesive substrate, creates the particle pickup pattern through its geometry, and enables transfer without requiring external pressure control systems. The structure itself performs the particle capture and transfer function, eliminating the need for porous plates and pressure reduction steps, thereby reducing device complexity and cost while maintaining particle distribution regularity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive substrate enables efficient and rapid transfer of large amounts of fine chips and particles with reduced static electricity-related failures, facilitating the use in micro-LED transfer devices and anisotropic conductive substrate manufacturing by ensuring reliable adhesion and uniform particle distribution.
Implementation Method 1
an adhesive layer provided on the support base member... the adhesive layer is provided at least on upper surfaces of the projected portions
Implementation Method 2
the support base member contains electroconductive particles and an insulating resin... reduced static electricity-related failures
Data Source
AI summary
An adhesive substrate includes a support base member and an adhesive layer provided on the support base member. The support base member contains electroconductive particles and an insulating resin, and has a recessed and projected pattern with two or more projected portions on one surface or both surfaces of the support base member. The adhesive layer is provided at least on upper surfaces of the projected portions in the recessed and projected pattern of the support base member. The adhesive layer on the upper surfaces of the projected portions has an upper surface with a curved surface. Thus, the present invention provides an adhesive substrate capable of selectively picking up and quickly transferring large amounts of fine chips and particles, a method for producing the adhesive substrate, and a transfer device.