Pre-formed Adhesive Tablet Placement via Vacuum Ejector Matrix
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Solution Overview
Problem
Existing methods for attaching components to glass or other substrates using adhesives face challenges such as nozzle cleaning issues, sticky adhesive application, and complications with double-sided tapes, particularly in scenarios where in-line assembly is not feasible or desired.
Innovation Solution
A method and apparatus involving a formed adhesive element-holding hopper and ejector system that positions and attaches formed adhesive elements to a heated bonding part, utilizing a vacuum chamber and ejector stamps to ensure precise and efficient adhesive application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive is applied by dosing with nozzles and spraying, then the application process is easy and inexpensive, but the nozzles require frequent cleaning to maintain consistency and the sprayed adhesive is sticky causing potential contact issues
Solution Approach 1:
The patent extracts the adhesive from the nozzle system and places it in pre-formed tablets. This eliminates the nozzle cleaning issue while maintaining consistent adhesive delivery, as the adhesive is contained in discrete units that are simply placed on the substrate rather than sprayed through potentially clogging nozzles.
Solution Approach 2:
The adhesive is prepared in advance as pre-formed tablets with consistent dosage and shape. This preliminary preparation eliminates the need for frequent nozzle cleaning during production, as the adhesive is already in its final application form and can be directly placed on the substrate without requiring spray equipment maintenance.
2Reliability
If double-sided tape with release layer is applied to bonding part, then adhesive is protected from inadvertent contact and can be used at room temperature, but the release layer must be removed prior to attachment and may tear creating imperfect adhesion
Solution Approach 1:
The patent removes the problematic release layer entirely by using pre-formed adhesive tablets that are self-contained. The adhesive is protected within the tablet structure itself, eliminating the need for a separate release layer that could tear or complicate the attachment process.
Solution Approach 2:
The adhesive tablet is designed as a disposable, single-use element that is applied directly to the substrate. Once the adhesive is applied, the tablet's structural role is complete and it becomes part of the bonded assembly, eliminating the need for removal of protective layers.
3Reliability
If double-sided tape is applied to bonding part, then adhesive is protected from inadvertent contact, but the attachment process is complicated and requires in-line assembly through a heater
Solution Approach 1:
The patent extracts the adhesive into pre-formed tablets that are applied directly to the substrate without requiring complex in-line assembly equipment. The tablets are handled as discrete components that can be placed on the substrate and then bonded using standard heating methods, eliminating the need for specialized tape application machinery.
Solution Approach 2:
The pre-formed adhesive tablet serves as an intermediary between the bonding part and substrate. It provides the adhesive function in a controlled, pre-prepared form that simplifies the overall process by eliminating the need for complex tape application equipment and in-line assembly through heaters.
4Ease of operation
If adhesive element is pre-applied to bonding part, then bonding part is ready to bond with no requirement for end user attachment, but the end user cannot apply the tablet at its own facility and schedule
Solution Approach 1:
The patent segments the bonding system into separate components: the bonding part and the adhesive tablet. This segmentation allows the adhesive tablet to be applied at different stages - either before shipment to provide ready-to-bond capability, or at the end user's facility according to their own schedule, thus providing both convenience and flexibility.
Solution Approach 2:
The adhesive tablet is prepared in advance as a complete, self-contained unit that can be stored and transported independently. This preliminary preparation allows it to be applied either before the bonding part is shipped (providing ready-to-bond capability) or at the end user's facility (providing application flexibility), as it requires no special preparation or equipment beyond simple placement and heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a robust, cost-effective, and efficient method for attaching bonding parts to substrates, ensuring consistent adhesive application and minimizing the risk of imperfect adhesion, while allowing for flexible scheduling and application of adhesives.
Implementation Method 1
A vacuum chamber is provided in the ejector system and is continuous with the apertures formed in the matrix plate
Implementation Method 2
heated bonding part
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
A method and apparatus for attaching formed adhesive elements to a heated bonding part are disclosed. The apparatus includes a hopper movably positioned over a matrix plate. The matrix plate includes a nesting matrix defined by formed adhesive element-receiving apertures. An ejector system is fitted beneath the matrix plate and includes a body having a vacuum chamber with an air inlet and an air exhaust. The chamber is fluidly continuous with the apertures formed in the matrix plate. The ejector system includes a lifting body to which ejector stamps and an inlet shut off shaft are attached. Channels for the ejector stamps are formed in the body of the ejector system. The ejector stamps are movably fitted in the apertures and the channels. In operation, the hopper slides over the matrix and deposits formed adhesive elements into the apertures then slides away. Movement of the formed adhesive elements into position into the apertures is assisted by a vacuum created in the vacuum chamber. A heated bonding part is positioned over then lowered onto the formed adhesive elements in the apertures of the nesting matrix. Assisted by the upward movement of the lifting body and its associated ejector stamps the bonding part with its attached formed adhesive elements is lifted away from the apparatus. The lifting body is then lowered and withdraws the inlet shut off shaft from the air inlet and allowing air to flow into the vacuum chamber and the apertures and out of the air exhaust.