Viscous Adhesive Dispensing Tail Break Detection
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Solution Overview
Problem
The existing methods for dispensing epoxy adhesive in semiconductor die attach applications are inefficient and wasteful, relying on trial and error to optimize parameters like pull-up speed, pull-up distance, and delay, and lack real-time monitoring capabilities for high-speed dispensing processes.
Innovation Solution
An apparatus and method using an imaging device to capture and analyze the adhesive tail break during dispensing, allowing for real-time monitoring and automatic optimization of dispensing parameters, including pull-up speed, pull-up distance, and delay, by detecting the adhesive tail break and adjusting parameters accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-speed dispensing is used to increase throughput, then productivity is improved, but real-time monitoring capability deteriorates making the process impossible to visually inspect
Solution Approach 1:
The patent replaces manual visual inspection with an automated imaging system using a camera to capture and process images of the adhesive tail break. This substitution enables objective, real-time monitoring of the dispensing process even at high speeds where human visual inspection is impossible.
Solution Approach 2:
The system implements feedback by detecting the adhesive tail break moment through image capture and analysis, then using this information to optimize dispensing parameters. The feedback loop enables continuous improvement of dispensing quality while maintaining high-speed operation.
2Manufacturing precision
If trial and error method is used to optimize dispensing parameters, then parameter optimization is achieved, but time consumption and material wastage increase significantly
Solution Approach 1:
The imaging system provides immediate feedback on adhesive tail break characteristics, allowing operators to objectively evaluate dispensing quality and adjust parameters systematically rather than through random trial and error, significantly reducing optimization time.
Solution Approach 2:
The patent replaces subjective operator judgment with objective image-based detection and analysis, enabling precise measurement and comparison of dispensing results that accelerates the optimization process and reduces unnecessary iterations.
3Ease of operation
If operator judgment is used for inspection, then subjective assessment is performed, but objectivity and consistency of inspection deteriorate
Solution Approach 1:
The system replaces subjective operator inspection with an automated imaging and analysis system that objectively captures and evaluates adhesive tail break characteristics, ensuring consistent and reproducible inspection results free from human bias.
Solution Approach 2:
The imaging system creates visual copies (images) of the adhesive tail break process, allowing for precise analysis and comparison without relying on operator interpretation. These images serve as objective records that can be analyzed systematically.
Data Source
AI summary
An apparatus and a method for dispensing a viscous adhesive for attaching a semiconductor die onto a substrate are provided, where the method comprises the steps of dispensing a volume of viscous adhesive from a nozzle onto the substrate and moving the nozzle away from the substrate such that an adhesive tail is formed between the nozzle and the volume of viscous adhesive. The method further comprises the steps of capturing multiple images of the adhesive tail with an imaging device as the nozzle is moving away from the substrate with an imaging device; and thereafter detecting with the imaging device an instant when the adhesive tail breaks from the volume of viscous adhesive.