Adhesive Die Catching Tape for Precise Discrete Component Transfer
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Solution Overview
Problem
Existing technologies face challenges in accurately placing discrete components on substrates during laser-assisted transfer processes, due to lateral movement, bouncing, or tombstoning of components, which affects precision and yield.
Innovation Solution
A tape system is introduced, featuring a flexible polymer substrate with an adhesive die catching film that includes viscoelastic, viscoplastic, or elastic adhesive materials. This tape is held on a vacuum chuck and used to receive discrete components transferred via a laser-assisted process, with the adhesive die catching film configured to retain the components and prevent post-transfer movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional substrate methods are used for discrete component transfer, then the process is simpler, but lateral movement, bouncing, and tombstoning occur reducing precision and yield
Solution Approach 1:
The substrate is segmented into multiple reusable tape segments with adhesive die catching films. Each tape segment can be independently used and replaced, allowing precise component capture on one segment while maintaining the integrity of the overall transfer system. This segmentation enables high precision placement without requiring the entire substrate to be complex.
Solution Approach 2:
The adhesive die catching film is prepared in advance on the flexible polymer substrate, creating a pre-configured capture surface. The vacuum chuck is pre-positioned to hold the tape before component transfer. These preliminary preparations ensure that when components arrive during laser-assisted transfer, the precision capture mechanism is already in place, preventing lateral movement and bouncing.
2Productivity
If reusable tapes are implemented, then substrate cleaning and reconfiguration time is reduced, but the tape system requires complex adhesive materials and vacuum holding mechanisms
Solution Approach 1:
The adhesive die catching film uses viscoelastic or viscoplastic materials whose adhesive parameters can be dynamically adjusted. The vacuum chuck applies controllable suction pressure to the flexible polymer substrate, allowing the system to adapt parameters rather than requiring complex mechanical structures. This parameter-based control achieves high productivity with manageable system complexity.
Solution Approach 2:
The vacuum chuck replaces complex mechanical clamping or fixing mechanisms with a pneumatic field (suction). This substitution simplifies the holding mechanism while enabling precise control of the tape position during component transfer, improving productivity without proportionally increasing complexity.
3Reliability
If adhesive die catching film with viscoelastic or viscoplastic materials is used, then component retention and prevention of post-transfer movement is improved, but the material selection and application process becomes more complex
Solution Approach 1:
The adhesive die catching film utilizes materials with specific viscoelastic or viscoplastic parameters that can be tuned during manufacturing. By controlling temperature, pressure, and material composition parameters, the adhesive properties are optimized for reliable component capture. This parameter-based approach achieves high reliability while keeping manufacturing processes standardized and manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tape system enhances precision and accuracy in placing discrete components by minimizing post-transfer movement and bouncing, thereby improving the yield of laser-assisted transfer processes. Additionally, the tape can be reused, increasing efficiency and reducing the need for substrate cleaning and reconfiguration.
Implementation Method 1
The tape is held on the vacuum chuck by suction applied to a rear surface of the flexible polymer substrate
Implementation Method 2
an adhesive die catching film disposed on the flexible polymer substrate facing a front surface of the flexible polymer substrate
Implementation Method 3
discrete components transferred via a laser-assisted process
Data Source
AI summary
A system includes a vacuum chuck; and a tape. The tape includes a flexible polymer substrate; and an adhesive die catching film disposed on the flexible polymer substrate facing a front surface of the flexible polymer substrate. The tape is held on the vacuum chuck by suction applied to a rear surface of the flexible polymer substrate.