Adhesive Tape Surface Hardness for Electronic Component Taping
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Solution Overview
Problem
Conventional adhesive tapes for electronic components suffer from excessive bleeding due to low surface hardness, leading to defective semiconductor devices and poor taping capability, which affects their electric reliability and durability.
Innovation Solution
An adhesive tape with a surface hardness greater than 25 MPa, achieved by forming an adhesive layer with a ratio of polyfunctional epoxy resin and polyfunctional phenol resin on a heat-resistant film, along with a hardener and rubber cross-linking agent, and optimizing the drying conditions to enhance the adhesive's mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If synthetic rubbery resin adhesive is applied onto heat-resistant film, then adhesiveness is improved, but surface hardness becomes too low causing excessive bleeding
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive layer by incorporating polyfunctional epoxy resin (30-70 wt%), polyfunctional phenol resin (30-70 wt%), and rubber cross-linking agent (5-20 wt%). This compositional parameter change increases the surface hardness of the adhesive layer to above 25 MPa while maintaining adequate adhesiveness, thereby preventing excessive bleeding during taping operations.
Solution Approach 2:
The patent creates a composite adhesive material system combining multiple resin types (epoxy resin, phenol resin) with rubber cross-linking agents. This composite formulation achieves a balance between hardness and adhesiveness that single-resin systems cannot achieve, resolving the contradiction between needing sufficient hardness to prevent bleeding and maintaining adhesiveness for proper bonding.
2Manufacturing precision
If adhesive hardness is increased to prevent bleeding, then taping capability is improved, but adhesiveness may be reduced
Solution Approach 1:
The patent optimizes the weight ratio parameters of the adhesive components, specifically using polyfunctional epoxy resin (30-70 wt%) and polyfunctional phenol resin (30-70 wt%) with rubber cross-linking agent (5-20 wt%). This parameter optimization ensures the adhesive layer achieves surface hardness above 25 MPa for improved taping capability while the functional groups in these resins maintain adequate adhesiveness through chemical bonding capabilities.
Solution Approach 2:
The composite adhesive system combines the high hardness contribution from epoxy and phenol resins with the flexibility and bonding capability from rubber cross-linking agents. This composite approach allows the adhesive layer to achieve both improved taping capability through increased hardness and maintained adhesiveness through the bonding properties of the multi-component system.
3Ease of manufacture
If conventional adhesive composition is used, then ease of manufacture is maintained, but electric reliability deteriorates due to excessive bleeding
Solution Approach 1:
The patent modifies the adhesive composition parameters by incorporating specific ratios of polyfunctional epoxy resin (30-70 wt%), polyfunctional phenol resin (30-70 wt%), and rubber cross-linking agent (5-20 wt%). This parameter change increases surface hardness to prevent bleeding, thereby improving electric reliability while maintaining a relatively simple manufacturing process of coating and drying.
Solution Approach 2:
The composite adhesive formulation combines multiple resin systems with cross-linking agents to achieve the desired performance. While the composition is more complex than conventional single-resin adhesives, the manufacturing process remains relatively simple, involving only coating and drying steps, thus maintaining ease of manufacture while dramatically improving electric reliability through reduced bleeding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive tape exhibits improved taping capability and electric reliability, with reduced surface tucks and defective lead frames, and maintains high resistance values over time, outperforming conventional tapes in terms of both mechanical and electrical performance.
Implementation Method 1
an adhesive tape, and, more particularly, to an adhesive tape for electronic components... an adhesive layer on at least one surface of a heat-resistant film... excellent in taping capability and electric reliability
Implementation Method 2
optimizing the drying conditions to enhance the adhesive's mechanical properties... being converted to B step through coating and drying the applied adhesive
Data Source
AI summary
An adhesive tape for attaching and fixing electronic components has an adhesive layer on at least one surface of a heat-resistant film. The surface hardness of the adhesive layer is about more than 25 MPa, and the surface hardness of the adhesive layer is about more than 80 MPa after thermosetting at 200° C. for about one hour.