Adhesive Tape Layer for Non-Standard Device Wafer Assembly

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Solution Overview

Problem

Non-standard structured devices, such as those in LED display technology, are inefficiently tested using manual or semi-automated methods due to their non-circular configurations, which deviate from industry-standard circular wafers, limiting the efficiency of data collection and analysis.

Innovation Solution

A test assembly is created with a device arrangement structure on a wafer, where an adhesive element, including a tape layer or adhesive layer, affixes the device structure to a standard-sized wafer, allowing for fully automated testing by encircling the wafer circumference, enabling electrical access and efficient data collection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If manual or semi-automated testing methods are used for non-standard structured devices, then the devices can be tested, but testing efficiency and data collection speed are reduced

Engineering Contradiction:

Improvetesting efficiencyVSAvoidautomation level

Core Design Contradiction:

ProductivityVSExtent of automation

Solution Approach 1:

The patent applies universality by designing a standardized wafer structure that can accommodate both standard circular wafer configurations and non-standard structured devices. The wafer includes a circular perimeter that interfaces with automated testing equipment while also providing mounting surfaces for various device arrangements, enabling a single platform to serve multiple testing purposes and achieve full automation for non-standard devices.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent introduces an intermediary wafer structure that acts as a mediator between non-standard structured devices and automated testing equipment. The wafer includes adhesive layers and mounting structures that facilitate the integration of non-standard devices into the automated testing system, enabling efficient data collection without requiring manual intervention.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Measurement precision

If non-standard structured devices are tested using manual methods, then device functionality can be verified, but data collection and analysis time increases significantly

Engineering Contradiction:

Improvedata collection accuracyVSAvoiddata collection time

Core Design Contradiction:

Measurement precisionVSLoss of time

Solution Approach 1:

The patent applies preliminary action by pre-configuring the wafer with standardized mounting structures, adhesive layers, and electrical contact arrangements before device placement. This pre-prepared infrastructure enables automated testing equipment to immediately access and test devices without manual setup, significantly reducing data collection time while maintaining measurement precision through consistent, reproducible positioning.

Inventive Principle:

Principle #10Preliminary action

3Productivity

If standard circular wafer configurations are used, then automated testing efficiency is maximized, but non-standard structured devices cannot be properly accommodated

Engineering Contradiction:

Improvetesting throughputVSAvoiddevice configuration flexibility

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent applies segmentation by dividing the wafer into distinct functional zones: a circular perimeter region that interfaces with automated testing equipment for high-throughput processing, and internal mounting regions that can accommodate various non-standard device arrangements. This segmented design allows each zone to optimize its function while working together to achieve both high productivity and device versatility.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs asymmetry by maintaining a symmetric circular outer perimeter for automated equipment compatibility while allowing asymmetric, non-standard device configurations within the internal mounting areas. This asymmetric internal layout enables accommodation of various LED display module arrangements and other non-standard devices while the symmetric outer form ensures compatibility with standardized automated testing systems.

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances testing efficiency by up to 90% compared to manual or semi-automated methods, facilitating automated data collection and analysis for non-standard structured devices by utilizing standard wafer configurations.

Implementation Method 1

an adhesive layer between the top wafer surface and the device arrangement structure

Methodology Applied

Scientific EffectAdhesive: Adhesive

Data Source

PatentUS11024552B2Device arrangement structure assembly having adhesive tape layer

Publication Date: 2021.06.01 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An assembly includes a wafer having a top wafer surface and a wafer circumference. The assembly further includes a device arrangement structure. The device arrangement structure includes a first surface having a perimeter, the perimeter being encircled by the wafer circumference in a plan view; and an array of devices, each device of the array of devices having an electrical contact on the first surface. The assembly further includes an adhesive element configured to affix the device arrangement structure in a stationary position relative to the wafer, wherein the adhesive element includes a tape layer having an adhesive surface attached to the top surface of the device arrangement structure and attached to a surface of the wafer.