Double-Sided Adhesive Tape for Semiconductor Packages
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Solution Overview
Problem
Current semiconductor package fabrication methods face challenges in achieving uniform thickness and reducing warpage and assembly time, particularly due to the limitations of existing adhesive tapes in the fan-out wafer-level package process.
Innovation Solution
A double-sided adhesive tape with a photosensitive polyimide layer is used, allowing for a de-bonding process that omits additional passivation layers, saving materials and reducing total assembly time, while ensuring uniformity and minimizing warpage by using a base film layer with greater thickness than the adhesive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional single-layer adhesive tape is used in semiconductor package fabrication, then the process is simpler, but thickness uniformity is poor and warpage occurs
Solution Approach 1:
The adhesive tape is divided into multiple layers: a first adhesive layer, a base film layer, and a second adhesive layer. This segmentation allows each layer to perform specific functions, with the base film layer providing structural support for thickness uniformity while the adhesive layers provide bonding functionality, thereby resolving the contradiction between manufacturing precision and device complexity.
Solution Approach 2:
The adhesive tape uses a composite structure combining different materials with complementary properties. The base film layer (e.g., polyimide) provides dimensional stability and thickness uniformity, while the adhesive layers provide bonding capability. This composite approach achieves both thickness uniformity and functional requirements without excessive complexity.
2Manufacturing precision
If additional passivation layers are added to ensure uniformity and reduce warpage, then manufacturing precision improves, but assembly time and material usage increase
Solution Approach 1:
The base film layer serves multiple functions simultaneously: it provides thickness uniformity, acts as a stress buffer to reduce warpage, and serves as an insulator. By combining these functions into a single layer, the invention eliminates the need for separate passivation layers, thereby reducing assembly time and material usage while maintaining manufacturing precision.
Solution Approach 2:
The base film layer inherently provides the functions that would otherwise require additional passivation layers. Its material properties (dimensional stability, stress buffering, insulation) allow it to self-service multiple protective and structural roles, eliminating the need for separate processing steps and reducing overall assembly time.
3Manufacturing precision
If a base film layer with greater thickness is used, then warpage is reduced and thickness uniformity improves, but the overall tape thickness increases
Solution Approach 1:
The base film layer is strategically positioned between the two thinner adhesive layers, creating a localized thick region where dimensional stability is most needed. This local quality approach provides thickness uniformity and warpage control at the critical interface while keeping the overall tape thickness manageable, as the adhesive layers remain thin for bonding purposes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient fabrication of semiconductor packages with improved thickness uniformity, reduced warpage, and shorter assembly times by leveraging the photosensitive adhesive layer as a stress buffer and insulator, facilitating the redistribution process.
Implementation Method 1
the second adhesive layer may include photosensitive polyimide
Data Source
AI summary
Provided are a double-sided adhesive tape, semiconductor packages, and methods of fabricating the packages. A method of fabricating semiconductor packages includes providing a double-sided adhesive tape on a top surface of a carrier, the double-sided adhesive tape including a first adhesive layer and a second adhesive layer stacked on the first adhesive layer, the first adhesive layer of the double-sided adhesive tape being in contact with the top surface of the carrier, adhering active surfaces of a plurality of semiconductor chips onto the second adhesive layer of the double-sided adhesive tape, separating the first adhesive layer from the second adhesive layer such that the second adhesive layer remains on the active surfaces of the semiconductor chips, patterning the second adhesive layer to form first openings that selectively expose the active surfaces of the semiconductor chips, and forming first conductive components on the second adhesive layer to fill the first openings.