Adhesive Tape Separating Tool for Semiconductor Substrates

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Solution Overview

Problem

Existing methods for separating adhesive tape from silicon substrates used in semiconductor and MEMS devices often result in adhesive residue remaining in openings, leading to defective chips and reduced yield.

Innovation Solution

An adhesive tape separating tool with protrusion portions formed on its surface, positioned to avoid contact with openings on the substrate, ensuring the adhesive tape is separated without entering the openings, and additional protrusion portions on either side of opening groups to stabilize the substrate during separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If adhesive tape is separated from silicon substrate using conventional methods with protrusion portions, then adhesive tape can be removed from substrate surface, but adhesive residue enters openings causing defective chips

Engineering Contradiction:

Improvechip manufacturing yieldVSAvoidadhesive residue contamination in openings

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The invention extracts and removes the harmful factor (protrusion portions) from the separating tool that causes adhesive residue to enter openings. By eliminating the protrusion portions entirely and using a flat separating tool surface instead, the source of contamination is removed while adhesive tape separation functionality is maintained through alternative mechanisms.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of using protrusion portions to lift and separate adhesive tape (conventional approach), the invention inverts the approach by using a flat surface that prevents adhesive tape from being pushed into openings during separation. The separation is achieved by lifting the substrate edge and inserting the flat separating tool underneath, reversing the conventional protrusion-based lifting mechanism.

Inventive Principle:

Principle #13The other way round (Inversion)

2Force

If protrusion portions are used to separate adhesive tape, then separation force can be applied to lift tape, but substrate stability during separation is compromised

Engineering Contradiction:

Improveadhesive tape separation forceVSAvoidsubstrate stability during separation

Core Design Contradiction:

ForceVSStability of the object's composition

Solution Approach 1:

The invention applies preliminary action by first lifting the substrate edge and positioning the flat separating tool underneath the adhesive tape before applying separation force. This preliminary positioning ensures substrate stability during the separation process, preventing unwanted movement or damage that would occur with protrusion portions applying force directly to the substrate surface.

Inventive Principle:

Principle #10Preliminary action

3Ease of manufacture

If conventional separation methods are used, then adhesive tape can be removed, but additional cleaning steps are required to remove adhesive residue from openings

Engineering Contradiction:

Improveseparation process simplicityVSAvoidadditional cleaning equipment and steps

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The invention converts the potential harm of adhesive residue entering openings into a benefit by using a flat separating tool surface that prevents adhesive tape from being pushed into openings during separation. The flat surface acts as a protective barrier, ensuring adhesive tape is separated cleanly without contamination, thereby eliminating the need for additional cleaning steps while maintaining process simplicity.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents adhesive residue from entering openings, improving yield by reducing defects in electrical connections and fluid flow paths, and stabilizing the substrate for smooth pickup.

Implementation Method 1

the work and the adhesive tape separating tool are pressurized in a direction in which they approach each other with the adhesive tape interposed therebetween, a position on the work to be contacted by the protrusion portion is determined

Methodology Applied

Scientific EffectPressure difference: Pressure Gradient

Implementation Method 2

suctioning and depressurizing a space on the protrusion portion side rather than the adhesive tape in this state

Methodology Applied

Scientific EffectSuction: Suction

Data Source

PatentUS10147621B2Adhesive tape separating tool, manufacturing apparatus of semiconductor chip, manufacturing apparatus of MEMS device manufacturing apparatus of liquid ejecting head, and separating method of adhesive tape

Publication Date: 2018.12.04 SEIKO EPSON CORP

AI summary

Provided is an adhesive tape separating tool which separates adhesive tape bonded to one face of a work which includes an opening on the one face from the work, in which a protrusion portion forming region in which a plurality of protrusion portions are formed is provided on a face on a side which comes into contact with the work in the tape separating tool, and the protrusion portion forming region is disposed at a position separated from a position facing the opening on the one face of the work.