Flexible Adhesive Tape Integrating Transducers and Wireless Circuits
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Solution Overview
Problem
Conventional technologies lack a cost-effective and flexible solution for integrating wireless communication and transducing circuits into adhesive tape platforms, limiting their application in various workflows and environments due to inflexibility and high production costs.
Innovation Solution
Development of low-cost, multi-function flexible adhesive tape platforms that integrate transducer and wireless communication components within a flexible adhesive structure, allowing seamless deployment in diverse applications such as sensing, tracking, and security, with embedded energy sources and efficient manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wireless communication and transducing circuits are integrated into adhesive tape platforms, then functionality and application versatility are improved, but manufacturing complexity and production costs increase
Solution Approach 1:
The adhesive tape platform is divided into multiple independent segments, each containing wireless communication and transducing circuits. This segmentation allows for modular manufacturing and deployment, reducing overall system complexity while maintaining high versatility across different applications.
Solution Approach 2:
The adhesive tape segments are designed with universal functionality to perform multiple tasks including sensing, tracking, and wireless communication. This multi-functionality approach reduces the need for separate specialized devices, thereby reducing manufacturing complexity while enhancing application versatility.
2Ease of operation
If adhesive tape platforms are made flexible and unobtrusive, then ease of deployment is improved, but structural stability and component integration become more difficult
Solution Approach 1:
The adhesive tape platform utilizes flexible substrates and thin film structures to maintain flexibility and ease of deployment. The wireless communication and transducing circuits are integrated onto these flexible bases using techniques that preserve the material's flexibility while ensuring structural stability for reliable operation.
3Adaptability or versatility
If multiple transducer and wireless communication components are integrated into each adhesive segment, then functionality is improved, but manufacturing cost increases
Solution Approach 1:
By dividing the adhesive tape into segments with standardized integrated components, the patent enables efficient batch manufacturing. Each segment contains the necessary transducer and wireless communication components in a consistent configuration, allowing for economies of scale and reduced per-unit manufacturing costs despite the multiple integrated functions.
Data Source
AI summary
A low-cost, multi-function adhesive tape platform with a form factor that unobtrusively integrates one or more transducers and one or more wireless communication devices in an adhesive product system. In an aspect, the adhesive product system integrates transducer and wireless communication components within a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the constituent components but also maintains the flexibility needed to function as an adhesive product that can be deployed seamlessly and unobtrusively into various applications and workflows, including sensing, notification, security, and object tracking applications, and asset management workflows such as manufacturing, storage, shipping, delivery, and other logistics associated with moving products and other physical objects.