Semiconductor Package Adhesive Profile Control via Tension Patterns
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Solution Overview
Problem
The existing semiconductor package manufacturing process faces challenges with adhesive material spreading due to gravity, leading to non-uniform thickness and potential stress concentrations that can cause chip or substrate cracks, affecting the reliability of the package.
Innovation Solution
Incorporating tension supplement patterns on the semiconductor chip's surface, which increase surface tension and minimize adhesive spread, ensuring a uniform adhesive thickness and enhanced contact area between the chip and substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If adhesive material is coated on package substrate without tension supplement patterns, then the coating process is simple, but the adhesive spreads laterally due to gravity causing non-uniform thickness
Solution Approach 1:
Tension supplement patterns are formed on the chip surface before adhesive coating, creating preliminary surface tension barriers that prevent lateral adhesive spread and ensure uniform adhesive thickness without complex process changes
Solution Approach 2:
Tension supplement patterns are selectively positioned at specific locations on the chip surface where adhesive spread needs to be controlled, rather than modifying the entire chip structure, thus maintaining local precision while minimizing overall complexity
2Reliability
If adhesive material is coated with high flowability for good filling, then the adhesive fills spaces well, but the adhesive spreads excessively due to gravity
Solution Approach 1:
Tension supplement patterns create preliminary counter-forces against gravitational pull on the adhesive material, preventing excessive lateral spread while allowing vertical filling, thus maintaining both reliability and controlled shape
Solution Approach 2:
The surface tension characteristics of the adhesive interface are modified by the tension supplement patterns, changing the adhesive's spreading behavior from gravity-dominated to tension-controlled, achieving both good filling and controlled profile
3Strength
If adhesive member has large contact area with substrate, then bonding strength is improved, but stress concentrations occur at edges causing cracks
Solution Approach 1:
Tension supplement patterns are prepared in advance to control adhesive flow and distribute stress evenly across the bonding interface, preventing edge stress concentrations that lead to cracks while maintaining strong bonding
Solution Approach 2:
The tension supplement patterns act as preliminary stress-distributing structures that cushion against concentrated forces at the adhesive edges, preventing crack initiation before stress can build up to critical levels
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tension supplement patterns improve the adhesive's surface tension, maintaining a steep adhesive profile and maximizing contact area, thereby enhancing the reliability and stability of the semiconductor package by preventing lateral spread and stress concentrations.
Implementation Method 1
Incorporating tension supplement patterns on the semiconductor chip's surface, which increase surface tension and minimize adhesive spread
Data Source
AI summary
A semiconductor package includes an adhesive member disposed on a package substrate to have a trapezoid cross-section view, and a semiconductor chip disposed on the adhesive member and attached to the package substrate by the adhesive member. The semiconductor chip has a first surface and a second surface facing the first surface, and the second surface of the semiconductor chip contacts the adhesive member. The semiconductor chip includes a tension supplement pattern attached to the second surface and spaced apart from the package substrate.