Adhesive Vent Patch for Battery Housing Overpressure Relief
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Solution Overview
Problem
Existing overpressure protection systems for battery housings are complex, heavy, and inflexible, requiring significant manufacturing effort and being designed for specific hole geometries, which makes them inefficient and costly for reliable pressure management and fluid-tight closure.
Innovation Solution
A method using adhesive elements with a pressure-sensitive adhesive layer and a carrier layer featuring a weakening area that breaks open irreversibly at a predetermined pressure, allowing for fluid-tight closure and pressure equalization, which can be easily automated and adapted to various hole geometries.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex overpressure relief devices are used for pressure management in battery housings, then reliable pressure relief is achieved, but device complexity and manufacturing effort increase significantly
Solution Approach 1:
The adhesive element is divided into functionally distinct layers: an adhesive layer for sealing and a carrier layer with a weakened region for pressure-sensitive opening. This segmentation allows each layer to specialize in its function, achieving reliable pressure relief while keeping the overall device simple.
Solution Approach 2:
The adhesive element is designed as a disposable, single-use component that provides overpressure protection through a simple carrier layer that breaks open at predetermined pressure. This replaces complex, expensive, reusable overpressure devices with a low-cost, simple solution.
2Reliability
If prior art overpressure relief devices are installed in continuous recesses, then pressure management is achieved, but significant installation space and manufacturing effort are required
Solution Approach 1:
The adhesive element merges the sealing function and overpressure relief function into a single integrated component. The adhesive layer provides fluid-tight sealing while the carrier layer with weakened region provides pressure-sensitive opening, eliminating the need for separate sealing and pressure relief components.
Solution Approach 2:
The carrier layer with weakened region automatically opens at predetermined pressure without requiring external activation or complex mechanisms. The adhesive element self-regulates pressure relief based on the pressure conditions, eliminating the need for external control systems.
3Reliability
If overpressure relief devices are designed for specific hole geometries, then reliable pressure relief is achieved, but adaptability to different hole dimensions is reduced
Solution Approach 1:
The adhesive element design with a carrier layer and weakened region can be adapted to various hole geometries and dimensions while maintaining the same fundamental pressure relief mechanism. The universal design allows application to different substrate types and hole configurations without requiring fundamentally different device architectures.
Solution Approach 2:
The geometry and dimensions of the weakened region in the carrier layer can be adjusted to match different hole sizes and shapes. By changing parameters such as the weakened region area, thickness, and configuration, the same basic adhesive element design can reliably serve different hole geometries.
4Extent of automation
If adhesive elements with weakened carrier layer are used for closure, then ease of automation and adaptability improve, but the complexity of designing the adhesive element structure increases
Solution Approach 1:
The weakened region is pre-formed in the carrier layer during adhesive element manufacturing, so that the pressure relief function is prepared in advance. This preliminary structuring allows simple automated application without requiring complex real-time adjustments or additional components during installation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a lightweight, cost-effective, and flexible means for reliable fluid-tight closure and pressure management, enabling precise adjustment of opening behavior and reducing manufacturing complexity and costs while ensuring safety against excessive pressures.
Implementation Method 1
an adhesive layer (16) comprising an adhesive composition... adhering the adhesive element to the substrate by means of the adhesive layer
Implementation Method 2
the adhesive element comprises a pressure opening region (20) which is at least partially surrounded by a weakened region (22) formed in the carrier layer... the action of a predetermined opening pressure on the pressure opening region at least partially irreversibly destroys the adhesive element in the weakened region
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
The invention relates to a method for closing a through-hole (10) in a substrate (12), comprising the process steps of: a) producing or providing an adhesive element (14), comprising: i) an adhesive layer (16) comprising an adhesive compound, ii) a carrier layer (18) arranged on the adhesive layer (16), comprising a first carrier layer (19), and b) adhering the adhesive element (14) to the substrate (12) by means of the adhesive layer (16), such that the adhesive element (14) completely covers the through-hole (10) and the through-hole (10) is fluid-tightly closed by the adhesive element (14), wherein the adhesive element (14) comprises a pressure opening area which is at least partially surrounded by a weakening area (22) formed in the carrier layer (18), wherein the mean thickness of the carrier layer (18) in the weakening area (22) is less than the mean thickness of the carrier layer (18) in the pressure opening area.wherein the adhesive element (14) is configured such that the application of a predetermined opening pressure to the pressure opening area at least partially and irreversibly destroys the adhesive element (14) in the weakening area (22) and forms a through-hole (24) in the adhesive element (14), and wherein the adhesive element (14) is applied such that the pressure opening area at least partially covers the through-hole (10) in the substrate (12).