Semiconductor-Encapsulating Adhesive Void Suppression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor device production, especially for COF (Chip on Film) modules, high-temperature solder bonding methods face challenges with void generation due to volatile components in adhesives, leading to reduced insulation reliability and productivity issues with narrow-pitch interconnects.
Innovation Solution
A semiconductor-encapsulating adhesive comprising an epoxy resin and a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator, which has lower viscosity and exhibits prompt curability, reducing void generation and enhancing connection reliability at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-temperature solder bonding is used to achieve fast connection and meet eutectic temperature requirements, then connection time is reduced and productivity is improved, but voids are generated due to volatile components in adhesive foam, decreasing insulation reliability
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by incorporating specific inorganic fillers (such as glass beads, alumina, or silica) with controlled particle sizes and distributions. This modification alters the adhesive's thermal behavior to suppress foam formation and volatile component generation during high-temperature bonding, enabling fast connection without compromising insulation reliability
Solution Approach 2:
The patent creates a composite adhesive material combining organic resin base components with inorganic filler particles. This composite structure provides both the bonding functionality of the organic resin and the thermal stability/void suppression properties of the inorganic fillers, resolving the contradiction between fast high-temperature connection and insulation reliability
2Length of moving object
If gap between semiconductor chip and substrate is reduced to accommodate narrow-pitch interconnects, then miniaturization and high functionality are achieved, but injection time increases due to capillary phenomenon, decreasing productivity
Solution Approach 1:
The patent applies adhesive in a pre-formed film state before the bonding process, rather than injecting liquid adhesive during assembly. This preliminary preparation of the adhesive layer eliminates the need for time-consuming liquid injection through narrow gaps, maintaining productivity while accommodating reduced gap sizes for narrow-pitch interconnects
3Manufacturing precision
If adhesive viscosity is reduced to improve embeddability and initial conduction, then manufacturing precision is improved, but void generation increases due to higher volatility at high temperature
Solution Approach 1:
The patent modifies the adhesive's physical parameters by incorporating inorganic fillers that alter the material's volatility characteristics. This enables the adhesive to maintain low viscosity for good embeddability while the filler particles suppress vaporization and foam formation at high bonding temperatures, reducing void generation
Solution Approach 2:
The inorganic filler particles act as intermediary components that mediate between the low-viscosity organic resin and the high-temperature bonding environment. The fillers prevent direct thermal decomposition and volatile release from the resin, allowing low viscosity without excessive void formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive suppresses void generation and improves connection reliability between semiconductor chips and substrates, even at high temperatures, ensuring excellent insulation and productivity in semiconductor device manufacturing.
Implementation Method 1
a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator
Implementation Method 2
an organic acid reactive with an epoxy resin
Data Source
AI summary
The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.