Electronic Component Series Adhesive Width Variation
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Solution Overview
Problem
Conventional electronic component series experience strong vibration and component scattering when the cover tape is peeled off, leading to poor mounting efficiency due to a significant difference in peel strength between storage recess and non-storage recess regions.
Innovation Solution
The electronic component series features a carrier tape with cyclically increasing adhesive regions around storage recesses, reducing the peel strength difference between these regions and minimizing component vibration by using a larger adhesive width for the first adhesive regions compared to the second adhesive regions, with a preferred ratio of 0.6 or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the cover tape is peeled off from the carrier tape, then the electronic components can be removed for mounting, but strong vibration occurs causing components to tilt or scatter
Solution Approach 1:
The adhesive regions are designed with different adhesive widths at different locations: a first adhesive region with a larger adhesive width corresponding to the storage recesses, and a second adhesive region with a smaller adhesive width in between. This local variation in adhesive width creates different peel strengths at different locations, reducing vibration during peeling while maintaining ease of component removal.
2Device complexity
If the adhesive width is uniformly distributed, then the structure is simple, but the peel strength difference between storage recess regions and non-storage recess regions is large causing strong vibration
Solution Approach 1:
Instead of uniform adhesive distribution, the invention implements local quality variation by providing a first adhesive region with larger adhesive width at storage recess locations and a second adhesive region with smaller adhesive width in between. This creates localized differences in peel strength that suppress vibration during the peeling process.
Solution Approach 2:
The adhesive regions are segmented into two distinct types: the first adhesive region corresponding to storage recesses and the second adhesive region in between them. This segmentation allows each region to have optimized adhesive width for its specific function, reducing overall vibration while maintaining structural organization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses component vibration and tilting, enhancing mounting efficiency, particularly for small electronic components, by ensuring a smooth peeling process and reducing the likelihood of scattering during attachment to a circuit board.
Implementation Method 1
a pair of adhesive regions which adhere to the carrier tape and to the cover tape
Data Source
AI summary
The present invention is an electronic component series, comprising a carrier tape which has a plurality of storage recesses cyclically arranged along the longitudinal direction, electronic components to be stored in the plurality of storage recesses, a cover tape established to cover the plurality of storage recesses of the carrier tape, and a pair of adhesive regions which adhere to the carrier tape and to the cover tape, and extend along the longitudinal direction of the carrier tape so as to enclose the plurality of storage recesses from both sides, wherein the adhesive width of the pair of adhesive regions is cyclically increased in size corresponding to the storage recesses respectively. With this electronic component series, the difference in the peel strength of the cover tape between the first adhesive regions and the second adhesive regions can be sufficiently reduced.