Optical Interposer Assembly Using Adiabatic Tapers for Low-Loss PIC Links
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Solution Overview
Problem
Modern high-performance optical information processing systems, such as photonic quantum computing and optical telecommunications, face challenges in achieving ultra-low loss connections between different optical devices, which are difficult to implement.
Innovation Solution
The development of an optical interposer that optically interconnects multiple photonic integrated circuits (PICs) using adiabatic tapers and waveguides, along with passive alignment techniques, to achieve ultra-low loss connections and integrate electrical components, ensuring precise alignment and coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional connection methods are used between optical devices, then manufacturing and alignment are simpler, but connection loss increases and performance decreases
Solution Approach 1:
An optical interposer is introduced as an intermediary component between photonic integrated circuits (PICs) to enable ultra-low loss optical connections. The interposer contains waveguides that optically couple multiple PICs together, achieving record-low loss measurements of 0.2 dB while maintaining distributed optical information processing capabilities
Solution Approach 2:
The system is divided into separate functional modules: multiple PIC chiplets are individually fabricated and then interconnected through the optical interposer. This segmentation allows for independent optimization of each PIC while the interposer provides standardized low-loss interconnection, resolving the contradiction between connection quality and manufacturing complexity
2Productivity
If multiple PICs are optically coupled together for complex computational tasks, then computational capability increases, but achieving ultra-low loss connections becomes more difficult
Solution Approach 1:
The optical interposer is pre-fabricated with integrated waveguides and coupling structures before the PIC chiplets are attached. This preliminary preparation of the interposer enables subsequent passive alignment and bonding processes to achieve the required precision for ultra-low loss connections without requiring complex active alignment during final assembly
Solution Approach 2:
The system replaces complex mechanical alignment and adjustment mechanisms with passive alignment techniques based on the pre-fabricated interposer structure. This substitution maintains manufacturing precision while enabling scalable production of multi-PIC systems for complex computational tasks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optical interposer enables efficient, low-loss optical and electrical signal transmission between PICs, enhancing the performance of complex computational tasks in photonic systems.
Implementation Method 1
couple light between waveguides of the PIC chip and waveguides of the optical interposer using adiabatic tapers
Implementation Method 2
optically interconnects multiple photonic integrated circuits (PICs) using adiabatic tapers and waveguides
Data Source
AI summary
An optical interposer can be formed from multiple wafers, including a photonic integrated circuit wafer and an interposer wafer. The photonic integrated circuit wafer can be bonded to a rigid carrier structure, and material near waveguides can be removed such that the waveguides can be coupled to waveguides of the interposer. The photonic integrated circuit can be separated into multiple rigid dies which can be bonded to the interposer separately. Additional processing can be performed to form electrical connections to the rigid dies to form an ultra-low optical interposer.