Adjacent Power Module Assembly for Low-Inductance Cooling
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Solution Overview
Problem
Existing power electronics systems face inefficiencies in cooling and assembly, particularly in the 'press-pack' configuration, which requires high external pressure, induces large parasitic inductances, and is not adaptable for parallel connections.
Innovation Solution
An electronic system comprising adjacent power modules connected via side and central heat sinks, allowing for efficient parallel and series connections without the need for high pressure, and reducing parasitic inductances through conductive, capacitive, and insulating electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If press-pack configuration is used to connect power modules in series, then electrical connection is achieved, but large parasitic inductances are induced
Solution Approach 1:
The patent transitions from traditional vertical/stacked power module arrangements to a planar arrangement where modules are positioned side-by-side. The connection switches from vertical stacking to lateral connection through shared heat sinks, fundamentally changing the spatial dimension of module interconnection and reducing current loop areas to minimize parasitic inductances.
Solution Approach 2:
The heat sink serves dual functions: thermal management and electrical connection. By making the heat sink electrically conductive and using it as the interconnection medium between adjacent power modules, the patent eliminates separate electrical connection structures, thereby reducing parasitic inductances while maintaining both cooling and electrical functions.
2Adaptability or versatility
If press-pack assembly is used to connect power modules, then series connection is achieved, but the system is not adapted for parallel connections
Solution Approach 1:
The heat sink is designed to perform multiple functions simultaneously: cooling the power component and providing electrical connection. This universal approach allows the same basic module structure to be connected in various configurations (series, parallel, anti-parallel) by simply changing the connection topology, greatly enhancing adaptability without increasing device complexity.
Solution Approach 2:
The power electronic system is divided into independent, modular power modules that can be freely assembled in different configurations. Each module is self-contained with its own power component and heat sink, allowing flexible arrangement for series or parallel connections without requiring complex integrated assembly structures.
3Device complexity
If air cooling system is used, then system simplicity is maintained, but cooling efficiency is not optimal and size/mass are large
Solution Approach 1:
The patent merges the cooling function directly into the electrical connection structure. The heat sink, which provides thermal management, is made electrically conductive and used as the interconnection medium between modules. This integration eliminates separate cooling components and reduces overall system size and mass while improving cooling efficiency through direct thermal contact.
4Temperature
If liquid cooling system is used to improve heat exchange, then cooling efficiency increases, but hydraulic circuits result in higher cost and complex maintenance
Solution Approach 1:
The patent extracts the hydraulic cooling system and replaces it with a simplified air cooling approach. By removing the liquid cooling infrastructure (pumps, pipes, reservoirs) and using only air as the cooling medium, the system achieves adequate cooling efficiency without the complexity and maintenance burden of hydraulic circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved cooling efficiency, reduced parasitic inductances, and simplified assembly for various power electronic structures like switching cells and inverters, enhancing performance and compactness.
Implementation Method 1
The heat produced by the power components of the elementary power modules must be dissipated
Implementation Method 2
An air cooling system comprising, for example, metal fins welded onto an aluminium base
Data Source
AI summary
The disclosure relates to an electronic system including a plurality of adjacent, elementary power electronics modules and connected to one another by an electrical module connection. Each elementary module including at least one power component integrated on a printed circuit inserted between two electrically conductive heat sinks. The electrical module connection is made by heat sinks at the side and/or central connection surfaces thereof.