Adjustable Anode Mask for Plating Film Uniformity
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Solution Overview
Problem
The in-plane uniformity of plating film thickness is affected by the dissolution of a soluble anode during electroplating, leading to uneven current distribution and reduced plating speed in the central portion of the substrate due to the terminal effect, resulting in non-uniform film thickness.
Innovation Solution
A plating apparatus with an adjustable anode mask and regulation plate that adjusts the opening dimensions based on the amount of electrolysis in the anode, ensuring consistent current distribution and film thickness across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a soluble anode is used during electroplating, then the anode dissolves to provide metal ions for plating, but the distance between the anode and substrate changes, causing non-uniform current distribution and reduced in-plane uniformity of plating film thickness
Solution Approach 1:
The patent applies the dynamics principle by making the anode mask adjustable rather than fixed. The mask's opening dimensions are dynamically changed during the plating process to compensate for anode dissolution. As the anode dissolves and the distance to substrate increases, the mask opening is enlarged to maintain consistent current distribution and plating uniformity throughout the process.
2Productivity
If the opening dimension of the anode mask is increased, then more current passes through the mask improving plating speed, but the terminal effect becomes more pronounced causing non-uniform current distribution
Solution Approach 1:
The patent dynamically adjusts the anode mask opening dimensions based on real-time monitoring of anode dissolution. By controlling the mask opening size to match the current anode-to-substrate distance, the system optimizes both plating speed and current distribution uniformity. The adjustment mechanism ensures that the mask opening is neither too small (which would limit current) nor too large (which would exacerbate terminal effect).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the uniformity of the plating film thickness by dynamically adjusting the anode mask and regulation plate openings in response to anode dissolution, mitigating the terminal effect and enhancing plating speed and film thickness consistency.
Implementation Method 1
a soluble anode that dissolves by a plating current
Implementation Method 2
an electroplating method in which miniaturization is possible
Data Source
AI summary
Provided are a plating apparatus and the like capable of improving the uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder for holding a substrate, an anode holder disposed in the plating tank to face the substrate held in the substrate holder, the anode holder being configured to hold a soluble anode, an anode mask attached to the anode holder, the anode mask having an opening through which a current flowing between the anode and the substrate passes, an adjustment mechanism configured to adjust an opening dimension of the anode mask, and a controller that controls the adjustment mechanism based on an amount of electrolysis in the anode while the anode is in use.