Adjustable BGA Decapsulation Holder for Multi-Size Packages

Solution Overview

Problem

The existing methods for decapsulating ball grid array (BGA) packages require multiple decapsulation holders for different sizes, leading to increased costs and longer processing times due to the need for frequent holder changes during the decapsulation process.

Innovation Solution

An adjustable decapsulation apparatus with a support member and a decapsulation source that secures BGA packages of varying dimensions, ensuring the solder balls remain free from contact with the decapsulation source, allowing for secure and efficient removal of the encapsulant layer without damaging the solder balls.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple decapsulation holders are used for different BGA package sizes, then each package size can be properly secured, but the device complexity and cost increase due to maintaining multiple holders

Engineering Contradiction:

Improveaccommodation of different BGA package sizesVSAvoidnumber of decapsulation holders

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The decapsulation holder is designed with an adjustable clamping mechanism that can accommodate multiple BGA package sizes using a single holder. The holder includes movable clamps that can be positioned at different locations along the support member to secure packages of varying dimensions, eliminating the need for multiple dedicated holders for different package sizes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The decapsulation holder incorporates dynamic adjustable elements including movable clamps that can slide along the support member and be positioned at different locations. This dynamic adjustment capability allows the same holder to adapt to different BGA package sizes by changing the clamp positions, rather than requiring fixed holders for each size.

Inventive Principle:

Principle #15Dynamics

2Adaptability or versatility

If multiple decapsulation holders are maintained for different package sizes, then proper securing is achieved, but the processing time increases due to frequent holder changes

Engineering Contradiction:

Improveaccommodation of different BGA package sizesVSAvoidprocessing time

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The decapsulation holder is designed with an adjustable clamping mechanism that can accommodate multiple BGA package sizes using a single holder. The holder includes movable clamps that can be positioned at different locations along the support member to secure packages of varying dimensions, eliminating the need for multiple dedicated holders for different package sizes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The adjustable clamps are designed to be quickly repositioned between packages without requiring complete holder changes. The clamps can be preliminarily adjusted to anticipated package sizes or quickly repositioned during the process, reducing the time penalty associated with adapting to different package dimensions.

Inventive Principle:

Principle #10Preliminary action

3Device complexity

If a single adjustable holder is used for different BGA package sizes, then the device complexity is reduced, but the ease of operation may be compromised due to adjustment requirements

Engineering Contradiction:

Improvenumber of decapsulation holdersVSAvoidholder adjustment

Core Design Contradiction:

Device complexityVSEase of operation

Solution Approach 1:

The decapsulation holder incorporates dynamic adjustable elements including movable clamps that can slide along the support member and be positioned at different locations. This dynamic adjustment capability allows the same holder to adapt to different BGA package sizes by changing the clamp positions, rather than requiring fixed holders for each size.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The clamping mechanism is designed to be self-adjusting or easily adjustable by the operator. The movable clamps can be manually positioned along the support member and secured at appropriate locations for different package sizes, making the adjustment process straightforward and requiring minimal skill or time.

Inventive Principle:

Principle #25Self-service

Data Source

PatentUS7772030B2Multipurpose decapsulation holder and method for a ball grid array package

Publication Date: 2010.08.10 SEMICON MFG INT (SHANGHAI) CORP

AI summary

A method and apparatus for the decapsulation of integrated circuit packages. The apparatus includes a support member, the support member having an open region and an adjustable device coupled to the support member. The adjustable device can be adapted to hold a BGA package such that a surface region of the BGA package is spatially disposed to face a decapsulation source and a plurality of balls on the BGA package remain free from contact from the decapsulation source and free from contact from a thermal source capable of causing damage to one or more of the balls. The decapsulation source is provided to subject a portion of the surface region of the BGA package for removal of the portion of the BGA package.