Adjustable Bond Wire Inductance via Magnetic Coupling
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Solution Overview
Problem
High-power RF/MW amplifiers face a trade-off between stability and gain, with existing wire bond inductors requiring expensive and time-consuming design modifications to optimize the quality factor (Q) for improved performance.
Innovation Solution
A bond wire arrangement with magnetically coupled control bond wires and resistive elements is introduced, allowing for adjustable quality factor and inductance by varying wire heights and shapes during the bonding process, enabling flexible optimization of RF match networks and power amplifier circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wire bond inductors are used with fixed design parameters, then manufacturing is simple, but the quality factor Q cannot be optimized for specific applications
Solution Approach 1:
The patent applies dynamics by making the wire bond structure adjustable after manufacturing. The wire height and shape can be modified during or after the bonding process to change the self-inductance and quality factor, transforming a static component into a dynamically adjustable one that adapts to different application requirements without requiring complete redesign
Solution Approach 2:
The patent implements parameter changes by allowing variation of physical dimensions (wire height, shape, spacing) to adjust electrical parameters (self-inductance, quality factor). This enables the same wire bond structure to be optimized for different Q factor requirements by simply changing geometric parameters during bonding or trimming processes
2Reliability
If design modifications are made to optimize quality factor, then performance improves, but manufacturing time and cost increase
Solution Approach 1:
The patent applies preliminary action by establishing the wire bond structure with initial parameters during the standard bonding process, and then making minor adjustments (trimming, height modification) afterward. This approach performs the bulk of the work during manufacturing and makes only small subsequent modifications, rather than requiring complete redesign or extensive post-processing
Solution Approach 2:
The patent enables parameter changes through controlled modification of wire geometry (height, shape, spacing) to adjust electrical characteristics. By changing only the necessary geometric parameters rather than redesigning the entire structure, the patent achieves performance optimization with minimal impact on manufacturing efficiency
3Manufacturing precision
If wire height and shape are varied to control self-inductance, then inductance can be optimized, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements parameter changes by varying wire height and shape to control self-inductance. By focusing modifications on specific geometric parameters (height, spacing, shape) rather than requiring complete redesign, the patent achieves precise inductance control through relatively simple bonding process adjustments
Solution Approach 2:
The patent applies self-service by allowing the wire bond structure itself to provide the adjustment mechanism. The wire's own geometry (height, shape, spacing) serves as the tuning parameter, eliminating the need for additional adjustment mechanisms or complex external control systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the quality factor and inductance of wire bonds, improving the performance of power amplifiers by allowing for flexible design adjustments without compromising stability or gain, and reduces the need for costly trimming processes.
Implementation Method 1
A signal bond wire (1) is arranged to operably connect a first signal line (4) of an electronic device (6) to a signal line (5) of another electronic device (7). A control bond wire (2) is magnetically coupled to the signal bond wire (1)
Data Source
AI summary
The invention provides a bond wire arrangement comprising a signal bond wire (1) for operably connecting a first electronic device (6) to a second electronic device (8), and a control bond wire (2) being arranged alongside the signal bond wire at a distance so as to have a magnetic coupling with the signal bond wire (1), and having a first end (11) coupled to ground, and a second end (12) coupled to ground via a resistive element (14). The proposed solution allows the control of the Q factor (losses) of wire bond inductors during assembly phase, which will save time and reduce overall design cycle as compared to known methods.