Adjustable Carrier Substrate for Semiconductor Package Warpage
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Solution Overview
Problem
Semiconductor packages experience warpage due to differences in thermal expansion coefficients between components during manufacturing processes, leading to reduced reliability.
Innovation Solution
A carrier substrate with adjustable thermal expansion is designed, featuring a main body portion and detachable carrier blocks with varying thermal expansion coefficients, allowing for tuning of the overall thermal expansion to match the device substrate, thereby preventing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a carrier substrate with fixed thermal expansion coefficient is used, then the manufacturing process is simple, but warpage occurs due to mismatch with device substrate thermal expansion
Solution Approach 1:
The carrier substrate is divided into a main body portion and multiple detachable carrier blocks with different thermal expansion coefficients. This segmentation allows selection of appropriate carrier blocks to match the thermal expansion characteristics of the device substrate, preventing warpage while maintaining structural integrity.
Solution Approach 2:
The carrier substrate transitions from a fixed, static structure to a dynamic, adjustable structure where carrier blocks can be selectively attached or detached. This dynamic configuration enables the carrier substrate to adapt its thermal expansion properties to match different device substrates, eliminating warpage issues.
2Reliability
If carrier blocks with different thermal expansion coefficients are used, then thermal expansion matching is improved, but the manufacturing process becomes more complex
Solution Approach 1:
Carrier blocks with different thermal expansion coefficients are prepared in advance and stored separately. During the manufacturing process, the appropriate carrier blocks are selected and attached to the main body portion based on the device substrate's thermal expansion characteristics. This preliminary preparation simplifies the overall manufacturing process by avoiding the need to create complex multi-material structures from scratch.
3Adaptability or versatility
If a single-material carrier substrate is used, then the structure is simple, but it cannot adapt to different device substrate thermal expansion requirements
Solution Approach 1:
The main body portion of the carrier substrate serves as a universal base that can accommodate multiple types of carrier blocks with different thermal expansion coefficients. This multi-functionality allows the same main body to be used with various device substrates having different thermal expansion characteristics, enhancing adaptability without increasing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The carrier substrate maintains process stability and improves the reliability of semiconductor packages by controlling thermal expansion, ensuring consistent performance across various manufacturing stages.
Implementation Method 1
a carrier substrate having an adjustable coefficient of thermal expansion... the main body portion having a first coefficient of thermal expansion; and a carrier block detachably mounted in the groove and having a second coefficient of thermal expansion different from the first coefficient of thermal expansion
Data Source
AI summary
A carrier substrate includes a main body portion that includes a plate having an upper surface and a lower surface disposed opposite to the upper surface, and a groove formed in the lower surface of the plate, the main body portion having a first coefficient of thermal expansion, and a carrier block detachably mounted in the groove and having a second coefficient of thermal expansion different from the first coefficient of thermal expansion.