Adjustable Claw Pick-and-Place Mechanism for Circuit Boards
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing pick-and-place devices for circuit boards lack flexibility and precision in handling boards of varying sizes, as they often rely on fixed vacuum suction mechanisms that may not accommodate different dimensions effectively.
Innovation Solution
A pick-and-place device with a clamping mechanism featuring adjustable claws and conveyor assemblies, driven by motors and gear systems, allowing for precise placement and handling of circuit boards of various sizes by adjusting the distance between clamping components and using conveyor belts to support and transport the boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If fixed vacuum suction mechanisms are used, then the device structure is simple, but the device cannot accommodate circuit boards of different sizes effectively
Solution Approach 1:
The patent applies the dynamics principle by making the clamping mechanism adjustable. The clamping distance between the first claw and second claw can be dynamically changed to accommodate circuit boards of different sizes. This is achieved through a second driving device that moves the base plate relative to the circuit board, allowing the clamping assembly to adapt its position and maintain effective clamping force across various board dimensions.
2Adaptability or versatility
If adjustable clamping mechanisms are used, then the device can handle various circuit board sizes, but the device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the clamping function into separate components: a base plate with a clamping assembly, and a driving mechanism. The clamping assembly itself is segmented into a first claw and second claw that can move independently. This modular segmentation allows each component to perform its specific function while reducing overall system complexity through functional decomposition.
Solution Approach 2:
The base plate serves multiple functions: it supports the clamping assembly, moves relative to the circuit board via the driving mechanism to adjust clamping distance, and provides a mounting platform for the second driving device. This multi-functionality reduces the need for separate components, thereby managing complexity while maintaining adaptability.
3Manufacturing precision
If vacuum suction mechanisms are used, then the picking process is simple, but the precision and stability for different board sizes are insufficient
Solution Approach 1:
The patent replaces the vacuum suction mechanism with a mechanical clamping system consisting of claws that physically grasp the circuit board. This mechanical substitution provides more precise and stable holding, especially for boards of varying sizes, as the clamping force can be mechanically adjusted and maintained consistently regardless of board dimensions.
Data Source
AI summary
This disclosure provides a pick-and-place device including base, carrying mechanism, driving mechanism and clamping mechanism. Carrying mechanism includes first side part, second side part, two conveyor assemblies and two first driving devices. Conveyor assemblies are respectively disposed on first side part and second side part and configured to carry circuit board. First driving devices are respectively connected to conveyor assemblies so as to respectively turn conveyor assemblies. Driving mechanism is disposed on base. Clamping mechanism includes base plate, clamping assembly and second driving device. Base plate is movably disposed on base via driving mechanism. Clamping assembly includes first claw and second claw are disposed on base plate and configured to pick and place circuit board. Second driving device is disposed on base plate. Second driving device is connected to clamping assembly so as to move first claw and second claw toward or away from each other.