Adjustable Cold Plate Coupling for CPU and VR Cooling
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Solution Overview
Problem
As electronic components miniaturize and increase in power requirements, legacy cooling methods struggle to manage heat effectively, particularly for high-power dense solutions like CPUs, necessitating advanced cooling solutions that can accommodate varying component heights and reduce thermal interface material thickness for improved performance.
Innovation Solution
The implementation of adjustable thermal coupling between a liquid-cooled CPU cold plate and adaptable voltage regulator (VR) cold plates, allowing for Z-height flexibility and universal interface compatibility, which reduces the need for additional liquid cooling lines and minimizes thermal interface material thickness, thereby enhancing thermal performance and accommodating different VR designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is implemented for high-power dense components, then thermal performance is improved, but device complexity and cost increase
Solution Approach 1:
The patent merges the CPU liquid cooling system with the VR cooling system by thermally coupling the VR cold plate to the CPU cold plate. This integration allows the VR to be cooled through the existing CPU liquid cooling loop, eliminating the need for separate liquid cooling lines and reducing system complexity while maintaining effective thermal management for both high-power components
Solution Approach 2:
The patent introduces a thermal interface plane as an intermediary between the VR cold plate and the CPU cold plate. This thermal interface serves as a mediator that enables heat transfer from the VR to the CPU cooling system, facilitating thermal coupling while accommodating variations in component heights through adjustable Z-height positioning
2Manufacturing precision
If fixed thermal coupling is used between cold plates, then manufacturing precision is improved, but adaptability to different component heights deteriorates
Solution Approach 1:
The patent implements a dynamic adjustable coupling mechanism that allows the VR cold plate to be positioned at different Z-heights relative to the CPU cold plate. The coupling can be adjusted to accommodate various VR heights, and once positioned, is secured to maintain precise thermal contact. This dynamic adjustment capability provides both adaptability to different component heights and manufacturing precision for thermal interface contact
3Temperature
If additional liquid cooling lines are added for VR cooling, then thermal performance is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines the VR cooling function with the existing CPU liquid cooling system. By thermally coupling the VR cold plate to the CPU cold plate, the VR is cooled through the same liquid cooling loop that serves the CPU. This merging approach provides effective cooling for both components without requiring additional liquid cooling lines, thereby reducing system complexity and cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the strain on the PCB, lowers costs by leveraging existing CPU liquid cooling investments, and improves thermal performance by allowing for customizable VR cold plates to interface with a universal CPU cold plate, effectively managing heat across varying VR heights and designs.
Implementation Method 1
liquid-cooled cold plate cooling a second heat source
Implementation Method 2
provides an adjustable thermal coupling between a liquid-cooled cold plate coupled to a first heat source and a second cold plate thermally coupled to a second heat source
Data Source
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AI summary
Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.