Adjustable Cooling Plate Assembly for PCB Thermal Contact
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Solution Overview
Problem
Conventional liquid cooling systems for electronic components face significant thermal resistance due to pedestals, which provide a sub-optimal thermal connection between high-power components and coolant, exacerbated by air gaps and dimensional variations, compromising thermal conductivity.
Innovation Solution
A cooling device with independently adjustable cooling plates formed of pressed sheet metal, featuring flexible conduits and optimized mating faces to maximize surface contact, minimize thermal path length, and apply localized compressive pressure for consistent thermal contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat cold plate is fitted over a PCB, then passive components are covered, but air gaps form between the plate and high-power components, increasing thermal resistance
Solution Approach 1:
The cooling plate is made adjustable and flexible rather than rigid and fixed. The plate can be independently positioned and tilted to match the topography of different components on the PCB, allowing dynamic adaptation to varying component heights and positions, thereby eliminating air gaps without requiring complex pedestal structures
Solution Approach 2:
The patent changes the physical parameters of the cooling plate by making it flexible and adjustable in position and orientation. This allows the plate to conform to the varying heights of different components, maintaining optimal thermal contact across the entire PCB surface without requiring additional structural elements
2Reliability
If pedestals are added to fill gaps between the cold plate and high-power components, then thermal contact is improved, but thermal resistance increases due to the length of the thermal path
Solution Approach 1:
The patent removes the intermediate pedestal structures from the thermal path entirely. Instead of adding these extra components, the cooling plate directly contacts the high-power components through independent positioning and tilting, eliminating the additional thermal resistance that pedestals would introduce while still maintaining consistent thermal contact
3Reliability
If Thermal Interface Material (TIM) is applied to fill gaps, then thermal conduction is improved, but thermal conductivity is compromised due to the thickness required to fill larger gaps
Solution Approach 1:
The patent replaces the reliance on thick TIM layers with a mechanical adjustment system. By making the cooling plate adjustable and tiltable, the system mechanically eliminates the need for thick interface materials, achieving direct or near-direct thermal contact that maintains high thermal conductivity without requiring substantial TIM application
4Loss of energy
If the cooling plate is made adjustable for each high-power component, then thermal contact is optimized, but device complexity increases
Solution Approach 1:
The patent creates a universal cooling plate design that can adapt to multiple different component configurations. A single adjustable plate structure serves the function of optimizing thermal contact with various high-power components across the PCB, eliminating the need for multiple specialized cooling solutions and reducing overall system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves high cooling efficiency with a lightweight and compact design by minimizing thermal resistance and maintaining consistent thermal contact despite component variations and vibrations.
Implementation Method 1
heat is transferred through the body and cooling tubes into the coolant
Implementation Method 2
coolant fluid may be circulated... heat is transferred... into the coolant, from where it is transported away
Implementation Method 3
Each cooling plate assembly (3) includes a pressing mechanism for pressing the cooling plate (31) against the high-power electronic component (7)
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
Cooling device (100) for cooling a plurality of high-power electronic components (7) mounted on a circuit board (1). A plurality of cooling plate assemblies (3a-d) are provided, each including a cooling plate (31) for mating to one of the high-power electronic components (7). An enclosure (32) is mounted to each cooling plate (31) for defining a coolant transport path over at least part of a surface thereof. One or more conduits (4) connect between the cooling plate assemblies (3) for fluid communication between their respective coolant transport paths. The conduits (4) are flexible such that the relative positions of the cooling plates (31) are adjustable for mating to respective high-power electronic components (7) in different planes.