Adjustable De-Chucking Voltage for Reliable Substrate Release
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Solution Overview
Problem
The challenge in semiconductor manufacturing lies in the inconsistent and improper de-chucking of substrates due to variations in substrate materials, leading to potential damage or misalignment during the de-chucking process, which affects the reliability and efficiency of substrate transfer.
Innovation Solution
The implementation of an adjustable de-chucking voltage system that monitors properties such as torque applied to the lift pin and adjusts the voltage level based on specific criteria to ensure safe and reliable de-chucking of substrates of varying materials, using a controller and power source to manage the electrostatic discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a fixed voltage level is applied to the chucking electrode for de-chucking, then the de-chucking process is simple, but substrate damage or improper release occurs due to material variations
Solution Approach 1:
The patent applies dynamics by transitioning from a fixed voltage system to a dynamic, adjustable voltage system. The de-chucking voltage is no longer static but varies based on real-time feedback from torque sensors and substrate properties, allowing the system to adapt to different substrate materials and conditions while maintaining reliable release
Solution Approach 2:
The patent implements feedback control by monitoring torque applied to the lift pin assembly and using this information to adjust the de-chucking voltage. The controller receives feedback from sensors and modifies the voltage level accordingly, ensuring optimal release for each substrate while maintaining process reliability
2Reliability
If the de-chucking voltage is increased to ensure release of all substrate materials, then release reliability improves, but substrate damage risk increases
Solution Approach 1:
The patent applies parameter changes by dynamically adjusting the voltage level based on substrate material properties and torque feedback. Instead of using a consistently high voltage that could damage substrates, the system modifies the voltage parameter in real-time to match the specific requirements of each substrate, ensuring reliable release without excessive force
Solution Approach 2:
The system transitions from static high voltage to dynamic adaptive voltage, where the de-chucking voltage changes based on real-time conditions. This allows the system to apply only the necessary force for release, avoiding substrate damage while maintaining reliability across different material types
3Object-affected harmful factors
If manual adjustment of de-chucking voltage is performed for each substrate, then substrate damage is minimized, but processing time and complexity increase
Solution Approach 1:
The patent implements self-service by enabling the system to automatically determine and adjust the appropriate de-chucking voltage based on substrate properties and torque feedback. The controller autonomously manages the voltage adjustment process without requiring manual intervention, reducing operational complexity while maintaining damage prevention
Solution Approach 2:
The feedback control system automatically monitors substrate conditions and torque levels, then adjusts the voltage accordingly. This automated feedback loop eliminates the need for manual voltage adjustment while preventing substrate damage, managing system complexity through intelligent control rather than simple mechanics
4Productivity
If automated voltage adjustment is implemented, then processing efficiency improves, but system complexity and cost increase
Solution Approach 1:
The automated system performs self-service by automatically selecting and adjusting the de-chucking voltage based on substrate identification and torque feedback. This automation eliminates manual intervention, improving processing efficiency while managing complexity through intelligent autonomous control rather than additional mechanical components
Solution Approach 2:
The system efficiently manages complexity by dynamically changing the voltage parameter based on real-time conditions rather than requiring complex mechanical adjustment mechanisms. This parameter-based control approach improves productivity while keeping the physical system relatively simple
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of the de-chucking process, reduces substrate damage, and minimizes transfer-related defects, allowing for efficient handling of various substrate materials and reducing tool downtime.
Implementation Method 1
a substrate support (115) comprising a chucking electrode (202)... electrostatically charged substrate
Implementation Method 2
adjusting a voltage level applied to the chucking electrode... electrostatic discharge
Data Source
AI summary
Aspects of the present disclosure generally relate to apparatus and methods for an adjustable de-chucking voltage associated with an electrostatically charged substrate in a processing chamber. An example method of de-chucking a substrate disposed in a process chamber includes processing a substrate in a chamber body, the substrate being coupled to a substrate support comprising a chucking electrode. The method further includes monitoring a property associated with a lift pin assembly movable relative to the chucking electrode via an actuator. The method further includes adjusting a first voltage level applied to the chucking electrode in response to the property associated with the lift pin assembly satisfying one or more criteria.