Height-Adjustable Edge Ring for Plasma Uniformity Control
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Solution Overview
Problem
Traditional edge rings in process chambers for substrate processing erode over time, leading to non-uniform plasma distribution and frequent replacements, resulting in increased maintenance downtime and costs.
Innovation Solution
A height-adjustable edge ring system with actuators and push pins that can elevate and tilt the edge ring to maintain plasma uniformity, allowing for in-situ adjustment and replacement without venting the process chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional edge rings are used in process chambers, then plasma uniformity is improved, but the edge rings erode over time requiring frequent replacement
Solution Approach 1:
The edge ring is designed with height-adjustable segments that can be dynamically repositioned vertically using actuators. This dynamic adjustment capability allows the edge ring to compensate for erosion by raising the inner surface height, thereby extending service life while maintaining plasma uniformity throughout the process chamber operational period.
Solution Approach 2:
The invention changes the vertical height parameter of the edge ring's inner surface through actuator-driven adjustment mechanisms. By modifying this geometric parameter in response to erosion, the system maintains effective plasma confinement and uniformity while extending the operational duration of the edge ring beyond traditional static designs.
2Manufacturing precision
If edge rings are frequently replaced to maintain plasma uniformity, then processing quality is improved, but maintenance downtime increases
Solution Approach 1:
The edge ring incorporates self-adjustment capabilities through integrated actuators and height-adjustable segments. This self-service mechanism automatically compensates for erosion by repositioning segments to maintain optimal height, eliminating the need for frequent manual replacements and reducing maintenance downtime while preserving substrate processing quality.
Solution Approach 2:
The dynamic height adjustment capability allows the edge ring to adapt to erosion in real-time during operation. This dynamic response maintains plasma uniformity and processing quality without requiring system shutdowns for replacement, thereby reducing maintenance downtime.
3Reliability
If traditional edge rings are used, then plasma uniformity is maintained initially, but erosion leads to decreased plasma uniformity
Solution Approach 1:
The system actively changes the vertical height parameter of the edge ring's inner surface through actuator mechanisms. This parameter adjustment compensates for erosion-induced geometry changes, maintaining plasma uniformity and process yield throughout the extended service life of the edge ring.
Solution Approach 2:
The height-adjustable edge ring system incorporates feedback mechanisms that monitor erosion and plasma uniformity, then actuate the adjustment mechanisms to restore optimal geometry. This closed-loop feedback maintains plasma uniformity and process yield despite ongoing erosion.
Data Source
AI summary
Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a process kit for processing a substrate is provided. The process kit has a support ring comprising an upper surface having an inner edge disposed at a first height and an outward edge disposed at a second height less than the first height, the inner edge having a greater thickness than the outward edge. An edge ring is disposed on the support ring, an inner surface of the edge ring interfaced with the inner edge of the support ring. A cover ring is disposed outward of the edge ring, the edge ring independently moveable relative to the support ring and the cover ring. Push pins are disposed inward of the cover ring, the push pins operable to elevate the edge ring while constraining radial movement of the support ring.