Adjustable Electrostatic Chuck for Multi-Diameter Wafer Handling

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Solution Overview

Problem

Conventional ion implantation systems require significant modifications and incur high costs and productivity losses when handling workpieces of varying diameters, as components like grippers and electrostatic chucks are typically designed for specific sizes, limiting their adaptability to different workpiece sizes and ion beam sizes.

Innovation Solution

A system featuring a central electrostatic chuck and adjustable peripheral electrostatic chuck members with shields, allowing for the translation between retracted and extended positions to accommodate workpieces of different diameters, along with a controller for precise positioning and energization, enabling the ion implantation system to handle various-sized workpieces without the need for extensive reconfiguration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional fixed-size electrostatic chucks and grippers are used, then the system is simple and reliable for a specific workpiece size, but it cannot accommodate differently-sized workpieces without extensive modifications

Engineering Contradiction:
Improveworkpiece size accommodationVSAvoidchuck and gripper configuration
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The electrostatic chuck is divided into multiple independently controllable electrode segments (e.g., central electrode and peripheral electrodes) that can be selectively activated. This segmentation allows the chuck to adapt to different workpiece sizes by engaging only the necessary segments, rather than requiring complete reconfiguration of the entire chuck assembly.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system incorporates movable or adjustable components such as extendable peripheral electrodes and reconfigurable gripper fingers that can dynamically change their position and configuration. This dynamic adaptability enables the same chuck and gripper assembly to accommodate multiple workpiece sizes without extensive modifications.

Inventive Principle:
Principle #15Dynamics

2Productivity

If dedicated equipment is designed for each workpiece size, then the system achieves optimal performance for that size, but productivity decreases due to equipment changes and reconfiguration

Engineering Contradiction:
Improveworkpiece processing efficiencyVSAvoidequipment reconfiguration time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The electrostatic chuck and gripper system is designed with multi-functional capabilities, where a single chuck assembly can process multiple workpiece sizes through selective activation of different electrode segments and adjustable gripping mechanisms. This universality eliminates the need to physically change equipment between different workpiece sizes, thereby maintaining high productivity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Manufacturing precision

If the ion beam size is matched to the workpiece size, then implantation precision is optimized, but system complexity increases when accommodating multiple workpiece sizes

Engineering Contradiction:
Improveion implantation accuracyVSAvoidbeam and workpiece size matching
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The system incorporates feedback mechanisms that detect the workpiece size and automatically adjust the ion beam parameters and electrostatic chuck configuration accordingly. This closed-loop control ensures optimal matching between beam size and workpiece size while minimizing manual intervention and system complexity.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient and cost-effective handling of workpieces of different diameters within the ion implantation system by allowing the ion beam to be configured for any size of workpiece clamped on the electrostatic chuck, reducing the need for extensive modifications and increasing productivity.

Implementation Method 1

An electrostatic chuck system comprises a central electrostatic chuck member having a first surface configured to clamp a workpiece thereon

Methodology Applied
Scientific EffectElectrostatic force: Electrostatics

Data Source

PatentUS9911636B1Multiple diameter in-vacuum wafer handling
Publication Date: 2018.03.06 AXCELIS TECHNOLOGIES INC
  • US9911636B1 patent drawing
  • US9911636B1 patent drawing
  • US9911636B1 patent drawing

AI summary

An electrostatic chuck and gripping system are configured for clamping and processing workpieces having differing diameters. An ion implantation apparatus selectively provides ions to a first workpiece and a second workpiece in a process chamber, where a diameter of the first workpiece is greater the second workpiece. A chuck supports the respective first or second workpiece within the process chamber during exposure to the ions. A load lock chamber isolates a process environment from an external environment and has a workpiece support for the respective first or second workpiece during a transfer of the first or second workpiece between the process chamber and the external environment. A vacuum robot transfers the first or second workpiece between the chuck and workpiece support, and has a gripper mechanism configured to selectively grip the first or second workpiece between a plurality of stepped guides.