Adjustable Gas Distribution Plate for Uniform Wafer Processing
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Solution Overview
Problem
Existing semiconductor processing apparatuses face challenges in achieving uniform gas flow distribution due to factors like contaminant buildup, chamber pressure variations, and changes in process parameters, leading to non-uniform deposition or etching across the wafer, which affects IC performance and yield.
Innovation Solution
Employing a gas distribution plate with adjustable iris diaphragms that allow for independent adjustment of hole sizes to optimize gas distribution, enabling compensation for changes over time and during different processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If fixed hole sizes are used in the gas distribution plate, then the device structure is simple, but gas flow uniformity deteriorates due to contaminant buildup and pressure variations
Solution Approach 1:
The gas distribution plate employs adjustable iris diaphragms instead of fixed holes, allowing the opening sizes to be dynamically modified. This enables the system to adapt to changing conditions such as contaminant buildup and pressure variations by recalibrating the gas flow distribution, thereby maintaining uniformity without requiring a completely complex reconfigurable structure.
Solution Approach 2:
The invention allows modification of the physical parameters of the gas distribution plate by adjusting the iris diaphragm openings. This parameter adjustment capability enables compensation for performance degradation over time, allowing the gas flow distribution to be optimized for different operating conditions while keeping the base structure relatively simple.
2Manufacturing precision
If adjustable iris diaphragms are used in the gas distribution plate, then gas flow uniformity is improved, but device complexity increases
Solution Approach 1:
The use of adjustable iris diaphragms introduces dynamic control capability to the gas distribution plate. Each iris diaphragm can be independently adjusted to modify gas flow through specific regions, enabling precise control over gas distribution patterns while maintaining a relatively compact and integrated structure.
Solution Approach 2:
The gas distribution plate is segmented into multiple regions, each controlled by an individual iris diaphragm. This segmentation allows independent adjustment of gas flow in different areas of the processing chamber, enabling localized optimization of gas distribution without requiring complete system redesign.
3Ease of operation
If hole sizes are not adjusted, then the device is easy to operate, but deposition thickness consistency deteriorates over time
Solution Approach 1:
The system enables parameter changes in the gas distribution plate by adjusting iris diaphragm openings based on observed performance degradation. This allows operators to recalibrate gas flow distribution to compensate for contaminant buildup and other time-dependent effects, maintaining deposition consistency while preserving relatively simple operation procedures.
Solution Approach 2:
The invention incorporates a feedback mechanism where gas flow uniformity and deposition quality are monitored over time, and iris diaphragm settings are adjusted accordingly. This feedback loop enables the system to automatically or manually compensate for performance degradation, maintaining consistent deposition thickness without requiring complex real-time control systems.
Data Source
AI summary
A gas distribution plate for a semiconductor processing apparatus includes a mounting plate having through-holes, and iris diaphragms or slotted apertures mounted over or in respective through-holes of the mounting plate. Each iris diaphragm or slotted aperture includes a motorized actuator operable to adjust the opening of the iris diaphragm or slotted aperture. In some embodiments, the gas distribution plate includes iris diaphragms, each including a hinge ring, a rotating ring, and iris leaves each having a first end coupled with the hinge ring and a second end opposite the first end slidably coupled with the rotating ring. If motorized, the motorized actuator may include a motor and a worm drive driven by the motor, with the worm drive operatively coupled with gear teeth disposed on the rotating ring.