Adjustable Ground Connector for Small-IC Test Contact Reliability

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Solution Overview

Problem

Current electrical grounding solutions for integrated circuit (IC) device testing are inadequate for smaller IC devices, as existing resilient connectors are too large or too short, leading to potential damage and inaccurate test results due to debris accumulation and increased electrical resistance.

Innovation Solution

A dual elastomer contact stacked vertically above a rigid ground block, with adjustable height to ensure proper electrical connection, and a secure attachment mechanism to prevent the ground block from dropping, combined with protrusions for enhanced contact and debris protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a resilient ground connector is used for larger IC devices, then electrical grounding and cushioning are improved, but the connector cannot be constructed to very small dimensions for smaller IC devices

Engineering Contradiction:
Improveelectrical groundingVSAvoidconnector size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The ground connector is segmented into multiple components: a rigid ground block providing electrical grounding, and separate resilient elements (elastomers or springs) providing cushioning. This segmentation allows each component to be optimized independently - the rigid block can be made very small for small IC devices while the resilient elements provide the necessary cushioning function.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The connector uses composite construction combining rigid material (ground block) with resilient material (elastomers or springs). This composite approach allows the connector to simultaneously provide electrical conductivity, mechanical resilience, and compact size by integrating materials with different properties in a single assembly.

Inventive Principle:
Principle #40Composite materials

2Reliability

If existing resilient ground connectors are used, then cushioning is provided, but the electrical current has to travel a longer distance through the connector

Engineering Contradiction:
ImprovecushioningVSAvoidcurrent path length
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

By separating the cushioning function (resilient elements) from the electrical conduction path (rigid ground block), the design allows current to travel through the short, direct path of the rigid block while the resilient elements provide cushioning without interfering with the electrical path length.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The rigid ground block acts as an intermediary that provides a direct electrical conduction path between the IC device and the load board, while the resilient elements mediate the mechanical cushioning function. This intermediary structure ensures minimal current path length while maintaining cushioning capability.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Volume of moving object

If a rigid ground block is used for smaller IC devices, then the connector can be made compact, but debris accumulation on the surface causes increased electrical resistance

Engineering Contradiction:
Improveconnector sizeVSAvoidelectrical resistance
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The resilient elements (elastomers or springs) act as intermediaries between the IC device contact pads and the rigid ground block surface. They provide a cushioning layer that prevents direct contact and debris accumulation on the ground block surface, while maintaining electrical conductivity through the resilient material itself.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The elastomeric resilient elements function as flexible contact surfaces that can conform to the contact pads while protecting the rigid ground block surface from debris accumulation. These flexible elements maintain electrical contact without the debris problems associated with rigid surfaces.

Inventive Principle:
Principle #30Flexible shells and thin films

4Ease of manufacture

If a rigid ground block is used, then manufacturing is simplified, but the lack of cushioning can lead to damage to the IC device and rigid block

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoiddamage protection
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The connector is segmented into a simple rigid ground block (easy to manufacture) and separate resilient elements (provide cushioning). This segmentation maintains manufacturing simplicity for the main structure while adding cushioning protection through the resilient components.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The composite structure combines the manufacturing simplicity of a rigid ground block with the damage protection of resilient materials. The rigid block provides structural integrity and ease of manufacture, while the elastomeric or spring resilient elements provide cushioning to prevent damage during contact.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration provides a resilient and flexible grounding solution that minimizes signal loss, reduces debris impact, and extends the service life of the load board by maintaining accurate connections and reducing wear and tear, while accommodating various IC device sizes and settings.

Implementation Method 1

a first elastomer (26), a second elastomer (28)... providing resilient contact

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

an electrically conductive rigid ground block (10)... in electrical contact with a contact pad of a load board... electrical current to travel

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11821916B2Ground connector in an integrated circuit testing apparatus
Publication Date: 2023.11.21 JF MICROTECH
  • US11821916B2 patent drawing
  • US11821916B2 patent drawing
  • US11821916B2 patent drawing

AI summary

An electrical ground connector for use as part of a test connector in an integrated circuit (IC) device testing apparatus having a resilient connector for electrical grounding and comprising a dual elastomer contact stacked vertically above a rigid ground block. The height of the ground block can be adjusted to compensate for the lack of height of the dual elastomer contacts, so that the entire connector has enough height to maintain electrical connection between a load board of the testing apparatus and the IC device.