Height-Adjustable Heat Sink for Plug-in Card Hot Plug
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Larger heat sinks required for effective cooling of plug-in cards often have greater thickness, which creates obstacles during hot plug operations due to limited opening heights in chassis panels, hindering smooth insertion and removal.
Innovation Solution
A height-adjustable heat sink design comprising a first part secured to the plug-in card and a second part that is movable relative to the first part, allowing for different heights by varying overlap, with optional heat radiating fins and transmission mechanisms for enhanced heat dissipation and easy adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a larger heat sink is used to improve heat dissipation performance, then the heat dissipation capability is improved, but the thickness increases creating obstacles during hot plug operations
Solution Approach 1:
The heat sink is designed with a movable second part that can change position relative to the first part, transforming the static thickness into a dynamic dimension. During hot plug operations, the second part moves to reduce the overall height, and during normal operation, it extends to maximize heat dissipation surface area, thus resolving the contradiction between thickness and operational accessibility
Solution Approach 2:
The heat sink is divided into two separate parts: a first part that remains relatively stable and a second part that is movable. This segmentation allows the heat sink to adjust its overall dimensions dynamically, enabling it to fit through chassis openings during hot plug operations while maintaining adequate heat dissipation capability when deployed
2Temperature
If a larger heat sink is used to improve heat dissipation performance, then the heat dissipation capability is improved, but the insertion and removal operations become difficult
Solution Approach 1:
The movable second part of the heat sink dynamically adjusts its position to facilitate smooth insertion and removal during hot plug operations, then extends to provide adequate heat dissipation surface area during normal operation, thus resolving the contradiction between operational ease and thermal performance
3Ease of operation
If the heat sink height is reduced to facilitate hot plug operations, then the ease of operation is improved, but the heat dissipation performance deteriorates
Solution Approach 1:
The heat sink employs a dynamic structure where the second part can move between retracted and extended positions, allowing it to provide adequate heat dissipation surface area when extended while reducing to minimal height during hot plug operations, thus resolving the contradiction between operational ease and thermal performance
Solution Approach 2:
The second part of the heat sink can be nested within or adjacent to the first part when retracted, minimizing the overall height during hot plug operations, and then extended outward to provide sufficient heat dissipation surface area during normal operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables smooth hot plug operations by adjusting the heat sink height to fit through chassis openings while maintaining effective heat dissipation performance, accommodating both insertion and removal without hindrance and improving thermal contact area for better cooling.
Implementation Method 1
the first heat radiating fin and the second heat radiating fin are staggered in the first direction and are in a thermal contact
Implementation Method 2
heat radiating fin extending along the first direction
Data Source
AI summary
Various embodiments of the present disclosure provide a heat sink for a plug-in storage card and a plug-in storage card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in storage card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in storage card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.