Adjustable Heat Sink Cooling Assembly for Tolerance Compensation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling devices struggle to effectively dissipate heat from objects with slight height differences due to manufacturing tolerances, particularly affecting heat-sensitive components and high-power chips, as thin thermally conductive paste layers are required, which may impair heat dissipation.
Innovation Solution
The heat sink is movably connected to a separate cooling component, allowing adjustment to compensate for manufacturing tolerances and maintain effective heat transfer, using axially movable hollow body portions and gaskets for fluid-tight connections, with optional clamping for stable contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If thermally conductive paste is used to compensate for manufacturing tolerances, then the heat sink can be mounted on objects with height differences, but the paste layer thickness impairs heat dissipation
Solution Approach 1:
A movable connection mechanism serves as an intermediary between the heat sink and the object to be cooled, replacing the thermally conductive paste. This mechanism includes a movable element that can adjust its position to accommodate height differences while maintaining direct thermal contact, thus eliminating the thermal resistance introduced by paste layers.
Solution Approach 2:
The connection between the heat sink and the object to be cooled is made dynamic rather than static. The movable connection allows for adjustment and compensation of manufacturing tolerances, enabling the system to adapt to height differences without requiring thick thermally conductive paste layers that would impair heat dissipation.
2Device complexity
If the heat sink is fixed to the base component, then the structure is simple, but manufacturing tolerances cannot be compensated
Solution Approach 1:
The connection between the heat sink and the base component is made dynamic through a movable connection mechanism. This allows the heat sink to be positioned accurately on objects with varying heights while maintaining a relatively simple overall structure. The movable element can be adjusted to compensate for manufacturing tolerances without requiring complex mounting systems.
3Reliability
If cooling fluid pressure is applied to ensure contact, then heat transfer is improved, but fluid pressure forces may damage sensitive components
Solution Approach 1:
The movable connection mechanism acts as an intermediary that decouples the cooling fluid pressure from the object to be cooled. The pressure forces are absorbed by the movable connection mechanism itself, which is designed to withstand these forces without transmitting them to the sensitive electronic components. This protects the components from damage while maintaining effective heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible positioning of the heat sink to accommodate manufacturing variations, ensuring stable heat transfer and preventing damage to sensitive components by neutralizing fluid pressure forces, thus enhancing cooling efficiency.
Implementation Method 1
heat sink, preferably a plate-shaped heat sink, consisting in particular of solid material, which can be arranged on an object to be cooled, for absorbing waste heat from the object to be cooled and for transmitting the waste heat to cooling fluid which flows through the cooling fluid line
Implementation Method 2
the cooling component and the base component can be moved relative to one another either toward one another or away from one another if required, in order to adjust the position of the heat sink of the cooling component
Implementation Method 3
The cooling component (12) has a cooling fluid line portion (18) of the cooling fluid line (13), wherein the cooling fluid line portion (18) of the cooling component (12) and the cooling fluid line portion (16, 17) of the base component (11) are connected in a fluid-conducting manner
Data Source
AI summary
A cooling device dissipates heat of an object to be cooled, and has a cooling fluid line for the passage of cooling fluid, base component which has one or more cooling fluid line portions of the cooling fluid line, and heat sink for absorbing waste heat from the object to be cooled and for transmitting the waste heat to cooling fluid. The heat sink is arranged on a cooling component of the cooling device which has at least one cooling fluid line portion and which, while connecting that cooling fluid line portion to a cooling fluid line portion of the base component, is movably connected to the base component, so that the cooling component and the base component can be moved relative to one another either toward one another or away from one another if required, in order to adjust the position of the heat sink of the cooling component.