Adjustable Heat Source Simulation for Server Chassis Testing

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Solution Overview

Problem

The challenge is to efficiently and cost-effectively conduct heat dissipation tests within servers, as the increasing heat generation from improved electric components necessitates proper heat management configurations, but testing with all components is time-consuming and costly.

Innovation Solution

An adjustable heat source simulation assembly is introduced, comprising first and second simulation heaters and a power output module, which can simulate the heating conditions of CPU, storage media, and graphic cards within a server. This assembly is integrated with air-cooling and liquid-cooling modules to simulate actual heat dissipation scenarios.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If all server components are used in heat dissipation testing, then testing accuracy and reliability are improved, but development time and cost increase significantly

Engineering Contradiction:

Improveheat dissipation testing reliabilityVSAvoiddevelopment time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent uses simulation heaters that replicate the thermal characteristics of actual server components (CPU, storage, graphics cards) without requiring the real components. These simulated heat sources generate comparable heat patterns and thermal signatures, enabling reliable heat dissipation testing while dramatically reducing development time and component costs.

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The simulation heaters are cost-effective, replaceable thermal sources that can be easily installed and removed. They provide sufficient thermal output for testing purposes at a fraction of the cost and complexity of actual server components, allowing rapid iterative testing without the burden of expensive hardware inventory.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Measurement precision

If all server components are used in heat dissipation testing, then testing accuracy is improved, but testing cost increases significantly

Engineering Contradiction:

Improveheat dissipation measurement accuracyVSAvoidtesting cost

Core Design Contradiction:

Measurement precisionVSEase of manufacture

Solution Approach 1:

The simulation heaters are designed to replicate the thermal output and heat distribution patterns of actual server components. By carefully engineering the heater elements and their thermal contact characteristics, the system achieves measurement accuracy comparable to using real components, while the cost is reduced through the use of simpler, less expensive simulated alternatives.

Inventive Principle:

Principle #26Copying

3Productivity

If simulation heaters are used instead of actual components, then development time is reduced, but testing reliability may be compromised

Engineering Contradiction:

Improvetesting speedVSAvoidheat dissipation testing reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The simulation heaters are engineered with specific thermal parameters (heat output, thermal conductivity, surface area) that match the characteristics of actual server components. By controlling these parameters, the system maintains testing reliability while enabling faster development cycles. The heaters can be adjusted to simulate different component thermal profiles as needed.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for rapid and cost-effective heat dissipation testing within servers, enabling the determination of heating situations and sufficient heat-dissipation capacity without requiring all server components to be developed, thereby significantly reducing development and testing time.

Implementation Method 1

The power output module is electrically connected to the at least one first simulation heater and the second simulation heater so as to control heating power of the at least one first simulation heater and the second simulation heater

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

The at least one first simulation heater is configured to be disposed in a server chassis and configured to receive an airflow provided by an air-cooling module

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

The liquid-cooling module is in thermal contact with the at least one first simulation heater

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12317447B2Adjustable heat source simulation assembly, chassis heat dissipation detection device and cabinet heat dissipation detection device

Publication Date: 2025.05.27 INVENTEC PUDONG TECH CORPOARTION

AI summary

This disclosure relates to an adjustable heat source simulation assembly includes at least one first simulation heater, a second simulation heater and a power output module. The at least one first simulation heater and the second simulation heater are configured to be disposed in a server chassis. The power output module is electrically connected to the at least one first simulation heater and the second simulation heater so as to control heating power of the at least one first simulation heater and the second simulation heater.