Adjustable Dual Heating Plate for Uniform Wafer Temperature
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the semiconductor industry, the photolithographic process requires precise temperature control to ensure uniform heating of wafers, which is challenging due to uneven heating patterns caused by non-uniform temperature distribution on thermal plates.
Innovation Solution
A heating device comprising a first heating portion for the wafer, a second heating portion arranged in parallel to heat the first portion, and an adjustment portion to adjust the vertical distance between the two heating portions, ensuring uniform temperature distribution and precise control over the wafer's heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single heating portion is used to heat the wafer, then the heating structure is simple, but the temperature uniformity on the wafer surface deteriorates
Solution Approach 1:
The heating system is divided into multiple heating portions (first heating portion and second heating portion) that can be independently controlled. Each heating portion has separate heating elements that can be adjusted to achieve uniform temperature distribution across the wafer surface, resolving the contradiction between structural simplicity and temperature uniformity.
2Device complexity
If the vertical distance between heating portions is fixed, then the device structure is simple, but the ability to adjust temperature distribution deteriorates
Solution Approach 1:
The vertical distance between the first heating portion and the second heating portion is made adjustable through a height adjustment mechanism. This dynamic adjustment capability allows the system to adapt to different heating requirements and achieve optimal temperature distribution, resolving the contradiction between structural simplicity and adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform heating of the wafer, ensuring consistent film thickness and precise key dimensions, thereby improving the quality and reliability of semiconductor wafers.
Implementation Method 1
a second heating portion, where the first heating portion and the second heating portion are arranged in parallel, and the second heating portion is configured to heat the first heating portion
Data Source
AI summary
The present disclosure provides a heating device and heating method for a semiconductor thermal process. The heating device includes: a first heating portion, on which a wafer to-be-heated is placed; a second heating portion, where the first heating portion and the second heating portion are arranged in parallel, and the second heating portion is configured to heat the first heating portion; and an adjustment portion, configured to adjust a vertical distance between the first heating portion and the second heating portion.