Adjustable Image Capture for Substrate Warpage Measurement

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Solution Overview

Problem

Current optical measurement equipment struggles to accurately measure warpage of substrates due to limited depth-of-field, leading to unclear images and reduced measurement precision, especially when warpage occurs at the substrate's periphery, requiring manual adjustment and repeated heating/cooling cycles, which is time-consuming and affects the stability of the substrate.

Innovation Solution

The implementation of adjustable image capturing devices that can move in three-dimensional directions and rotate automatically, coupled with a distance measuring apparatus, ensures that the substrate's warpage is measured within the devices' depth-of-field, even at the periphery, using a controller to adjust their positions and orientations for precise imaging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the image capturing devices use a fixed depth-of-field, then the device structure is simple, but the measurement precision is reduced when warpage occurs at the substrate periphery

Engineering Contradiction:
Improvewarpage measurement precisionVSAvoidadjustment apparatus complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The image capturing devices are made dynamically adjustable through the adjustment apparatus, which enables movement in three-dimensional directions (X, Y, Z axes) and rotation. This dynamic positioning allows the depth-of-field to adapt to different warpage locations on the substrate, ensuring high measurement precision whether the warpage is at the center or periphery.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The adjustment apparatus adds dimensional freedom by enabling the image capturing devices to move not only in the traditional X-Y plane but also in the Z-direction (depth) and through rotation. This multi-dimensional adjustment capability allows the system to maintain the warpage within the depth-of-field regardless of its location on the substrate.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If manual adjustment of image capturing devices is performed repeatedly, then measurement coverage is improved, but the substrate stability deteriorates due to multiple heating and cooling cycles

Engineering Contradiction:
Improvemeasurement efficiencyVSAvoidsubstrate stability
Core Design Contradiction:
ProductivityVSStability of the object's composition

Solution Approach 1:

The adjustment apparatus automatically positions the image capturing devices without requiring manual intervention. The system self-adjusts the device positions and orientations based on the substrate's warpage characteristics, eliminating the need for repeated manual adjustments and the associated heating/cooling cycles that would otherwise be required.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The adjustment apparatus enables continuous measurement capability by maintaining optimal positioning of the image capturing devices throughout the measurement process. This eliminates interruptions and repeated heating/cooling cycles, allowing the measurement to proceed continuously while preserving substrate stability.

Inventive Principle:
Principle #20Continuity of useful action

3Measurement precision

If the image capturing devices are fixed in position, then the device complexity is low, but the measurement precision is reduced for peripheral warpage

Engineering Contradiction:
Improveperipheral warpage measurement precisionVSAvoidoperation simplicity
Core Design Contradiction:
Measurement precisionVSEase of operation

Solution Approach 1:

The adjustment apparatus transforms the fixed image capturing devices into dynamically adjustable ones, enabling movement in three-dimensional space and rotation. This dynamic capability allows operators to easily position the devices to capture peripheral warpage with high precision, making the system both powerful and user-friendly.

Inventive Principle:
Principle #15Dynamics

4Measurement precision

If multiple heating and cooling cycles are performed for measurement, then measurement completeness is improved, but the measurement time increases

Engineering Contradiction:
Improvecomprehensive warpage measurementVSAvoidmeasurement time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The adjustment apparatus enables continuous measurement by eliminating the need for repeated heating and cooling cycles. The system can comprehensively measure warpage across the entire substrate in a single continuous operation, significantly reducing measurement time while maintaining complete measurement coverage.

Inventive Principle:
Principle #20Continuity of useful action

Data Source

PatentUS11375124B2Optical measurement equipment and method for measuring warpage of a workpiece
Publication Date: 2022.06.28 ADVANCED SEMICON ENG INC
  • US11375124B2 patent drawing
  • US11375124B2 patent drawing
  • US11375124B2 patent drawing

AI summary

An optical measurement equipment includes an adjustment apparatus and at least two image capturing devices. The image capturing devices have a depth-of-field and attached to the adjustment apparatus. The image capturing devices are adjusted by the adjustment apparatus such that a portion to be measured of a workpiece is located within the depth-of-field of the image capturing devices.