Adjustable Impedance PCB via Substrate Openings
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Solution Overview
Problem
The characteristic impedance of connection terminals in suspension boards is difficult to adjust due to dimensional constraints, making it challenging to achieve impedance matching with terminals or wirings of different characteristic impedances in external circuits.
Innovation Solution
A printed circuit board design that includes a support substrate with openings overlapping the connection terminals, allowing the characteristic impedance to be adjusted by varying the area of these openings, enabling optional impedance matching with external circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the area of the connection terminal is changed to adjust characteristic impedance, then the characteristic impedance can be adjusted, but dimensional constraints of the terminal prevent optional adjustment
Solution Approach 1:
The patent introduces openings in the support substrate below the connection terminals to adjust characteristic impedance. Instead of changing the terminal area in the planar dimension (which is constrained), the invention uses the vertical dimension by creating openings through the substrate. This allows impedance adjustment without modifying terminal dimensions, resolving the contradiction between impedance adaptability and dimensional constraints.
Solution Approach 2:
The patent creates a porous structure in the support substrate by forming openings below the connection terminals. These openings modify the electrical characteristics and capacitance of the terminal structure, enabling characteristic impedance adjustment. The porous configuration allows impedance tuning without changing terminal area, addressing the technical contradiction.
2Adaptability or versatility
If openings are formed in the support substrate to adjust terminal impedance, then characteristic impedance can be optionally adjusted, but the structure becomes more complex
Solution Approach 1:
The patent segments the support substrate by forming discrete openings below specific connection terminals that require impedance adjustment. Instead of modifying the entire substrate uniformly, only targeted regions are opened, allowing selective impedance control. This segmentation approach provides adaptability while minimizing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adjustable characteristic impedance of the connection terminals ensures effective impedance matching with external circuits, enhancing the electrical connectivity and performance of the printed circuit board.
Implementation Method 1
a capacitive component of the connection terminal below which the opening is formed is selectively reduced
Data Source
AI summary
An insulating layer is formed on a support substrate having a conductive property. Write wiring traces, read wiring traces, and first and second electrode pad pairs are formed on the insulating layer. The first electrode pad pair is connected to the write wiring traces. The second electrode pad pair is connected to the read wiring traces. Parts of regions of the support substrate, which overlap the electrode pads, are removed. Thus, openings are formed in the regions of the support substrate, which overlap the electrode pads.