Adjustable Inductor for Impedance Matching in Semiconductor Packages
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Solution Overview
Problem
The miniaturization of semiconductor device packages is hindered by the size of passive components, and embedding these components in a semiconductor substrate makes it difficult to configure, modify, or replace them for impedance matching.
Innovation Solution
An electrical device is designed with adjustable capacitors and inductors, featuring a substrate, dielectric layers, and dies, where the adjustable inductors include pillars and metal strips with varying widths, and the capacitors have multiple electrodes with adjustable connections to allow for flexible impedance matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive components are used for impedance matching in a semiconductor device package, then impedance matching is achieved, but the size of the passive components adversely affects miniaturization of the package
Solution Approach 1:
The patent merges the passive components (inductors and capacitors) directly into the semiconductor substrate, combining previously separate components with the substrate itself. This integration eliminates the need for discrete passive components, achieving impedance matching while minimizing package size.
Solution Approach 2:
The patent transitions from planar two-dimensional layout to three-dimensional vertical stacking by forming conductive structures at different depths within the substrate. Multiple metal layers and via structures enable impedance matching components to be stacked vertically, reducing the horizontal footprint and enabling miniaturization.
2Area of stationary object
If passive components are embedded in a semiconductor substrate, then miniaturization is achieved, but it becomes difficult to configure, modify or replace such embedded passive components for impedance matching
Solution Approach 1:
The patent implements adjustable inductors and capacitors with variable parameters that can be dynamically reconfigured. The inductors include adjustable tap points and the capacitors include variable capacitance structures, allowing the impedance matching network to be adapted to different frequency ranges and impedance requirements after fabrication.
Solution Approach 2:
The passive components are divided into multiple segmented sections with adjustable connections. The inductor is divided into multiple windings with selectable tap points, and the capacitor is divided into multiple electrode pairs with selectable connections, enabling discrete adjustment of component values to optimize impedance matching for different applications.
Data Source
AI summary
An electrical device comprises a substrate, a first dielectric layer, a first die, an adjustable inductor and a second die. The substrate has a first surface. The first dielectric layer is disposed on the first surface of the substrate and has a first surface. The first die is surrounded by the first dielectric layer. The adjustable inductor is electrically connected to the first die. The adjustable inductor comprises a plurality of pillars surrounded by the first dielectric layer, a plurality of first metal strips disposed on the first surface of the first dielectric layer and electrically connected to the pillars, and a plurality of second metal strips disposed on the first surface of the first dielectric layer and electrically connected to the pillars. A width of at least one of the second metal strips is different than a width of at least one of the first metal strips. The second die is electrically connected to the adjustable inductor.