Adjustable Inlet Module Airflow Area Control

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Solution Overview

Problem

Existing IC testers face heat dissipation performance issues when different test boards are used, as the fixed heat duct areas do not match the requirements of the test boards being replaced, affecting airflow and heat dissipation efficiency.

Innovation Solution

An adjustable inlet module with an insert board and adjusting plates that allow for the reduction of airflow area through a second air passage, enabling flexibility in accommodating test boards with varying heat dissipation needs by selectively overlapping an adjusting plate with the second air passage, thereby adjusting the duct size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a fixed heat duct area is designed for a specific test board, then the heat dissipation performance for that test board is optimized, but the heat dissipation performance deteriorates when different test boards with varying heat dissipation needs are used

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidadaptability to different test boards
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The patent applies the dynamics principle by making the heat duct area adjustable rather than fixed. The adjusting plate can be positioned at different locations to change the effective area of the second air passage, allowing the system to adapt dynamically to different heat dissipation requirements of various test boards. This resolves the contradiction by enabling the heat duct area to be modified based on the specific test board being used.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements parameter changes by allowing the area of the heat duct (second air passage) to be changed according to different test boards. By adjusting the position of the adjusting plate, the effective area parameter of the air passage is modified to match the heat dissipation needs of different test boards, thus maintaining optimal heat dissipation performance across various configurations.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If the heat duct area is increased to improve heat dissipation, then the airflow rate increases, but the device complexity increases due to the need for adjustable components

Engineering Contradiction:
Improveairflow rateVSAvoidinlet module structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the inlet module into distinct components: the insert board with multiple air passages, the adjusting plate with positioning portions, and the housing. This segmentation allows the adjusting plate to be independently positioned to modify the heat duct area without redesigning the entire inlet module, thus managing complexity while enabling airflow adjustment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The adjusting plate serves multiple functions: it acts as a flow restrictor, a positioning element, and an adjustable component. By making this single component multi-functional, the patent reduces the need for additional separate parts to control airflow, thereby managing device complexity while maintaining the ability to adjust heat duct area for different airflow requirements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The adjustable inlet module ensures optimal heat dissipation performance across different test boards by allowing for customizable airflow area adjustments, enhancing the electronic device's ability to handle various IC testing requirements without compromising heat dissipation.

Implementation Method 1

The adjusting plate is selectively usable to connect the second positioning portions respectively to the first positioning portions so that the adjusting plate is positioned and that the opening and the second air passage are overlapped with each other, thereby reducing an area of the airflow passing through the second air passage.

Methodology Applied
Scientific EffectAirflow control through geometric adjustment:

Data Source

PatentUS12096593B2Inlet module, housing and electronic device
Publication Date: 2024.09.17 CHROMA ATE INC
  • US12096593B2 patent drawing
  • US12096593B2 patent drawing
  • US12096593B2 patent drawing

AI summary

An inlet module is adapted to be disposed on a housing of an electronic device, and includes an insert board and at least one adjusting plate. The insert board has a plurality of first air passages, at least one second air passage, and at least one positioning unit. The second air passage is located between two of the first air passages, and has an area larger than that of each first air passage. The adjusting plate has an opening having an area smaller than that of the second air passage. The adjusting plate is operable to be positioned at a position where the opening and the second air passage are overlapped with each other, thereby reducing an area of the airflow passing through the second air passage.