Adjustable Mask Member for Encapsulation Layer Deposition

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Solution Overview

Problem

The existing methods for forming encapsulation layers in display and semiconductor manufacturing are costly and time-consuming due to the need for multiple masks with different sizes and properties, and the complex process of aligning and maintaining these masks, which complicates the manufacturing structure and process, and increases the risk of moisture infiltration and yield reduction.

Innovation Solution

A substrate processing system and method that adjusts the arrangement height of a single type of mask member with respect to the substrate to form encapsulation layers of various structures, simplifying the manufacturing process, reducing costs, and preventing moisture infiltration by allowing the deposition area to be adjusted without the need for multiple masks, thereby standardizing the mask member and streamlining the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple masks with different sizes and properties are used to form encapsulation layers, then various structures of encapsulation layers can be formed, but the manufacturing cost and complexity increase significantly

Engineering Contradiction:

Improvecapability to form various encapsulation layer structuresVSAvoidcomplexity of manufacturing process and mask management

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

A single mask member is designed to perform multiple functions by adjusting its arrangement height relative to the substrate. The mask member can form different encapsulation layer structures (first, second, and third encapsulation layers with varying thicknesses and patterns) solely through height adjustment, eliminating the need for multiple specialized masks and simplifying the manufacturing process

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Manufacturing precision

If multiple masks are disposed in different chambers, then deposition can be performed for each encapsulation layer, but the manufacturing process becomes complicated and inefficient

Engineering Contradiction:

Improveprecision of encapsulation layer depositionVSAvoidefficiency of manufacturing process

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

Multiple deposition processes that were previously performed in separate chambers are merged into a single chamber. The mask member remains in the same chamber throughout the process, and only its height is adjusted to create different encapsulation layer structures, thereby streamlining the manufacturing process and improving productivity

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If different masks are prepared for different encapsulation layer structures, then various structures can be achieved, but the manufacturing cost of mask members increases

Engineering Contradiction:

Improvevariety of encapsulation layer structuresVSAvoidcost of mask member manufacturing

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Instead of manufacturing different masks with varying sizes and properties, the invention changes the height parameter of a single mask member to achieve different encapsulation layer structures. This parameter adjustment approach eliminates the need for costly mask manufacturing variations while maintaining the ability to produce diverse encapsulation structures

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the manufacturing cost and complexity of the encapsulation layer process, improves process efficiency, and enhances the stability of the encapsulation layers by allowing the formation of various structures using a single mask member, thereby preventing moisture infiltration and reducing the occurrence of defects like dark spots.

Implementation Method 1

forming an encapsulation layer covering a device formed on the substrate by adjusting an arrangement height of the mask member with respect to the substrate

Methodology Applied

Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Data Source

PatentUS10418589B2Substrate processing method

Publication Date: 2019.09.17 WONIK IPS CO LTD

AI summary

A substrate processing system and substrate processing method. The substrate processing system includes: a chamber; a susceptor disposed inside the chamber and allowing a substrate to be seated thereon; a mask member disposed over the substrate; and a controller for controlling an arrangement height of the mask member with respect to the substrate. Here, an encapsulation layer covering a device formed on the substrate is formed using the mask member adjusted in height by the controller. The substrate processing method includes disposing a substrate inside a chamber; disposing a mask member over the substrate inside the chamber; and forming an encapsulation layer covering a device formed on the substrate by adjusting an arrangement height of the mask member with respect to the substrate.