Adjustable Mirror Block for Semiconductor Side Face Inspection
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Solution Overview
Problem
Traditional methods for inspecting the side faces of semiconductor devices are costly, inflexible, and prone to errors due to the need for custom mirror blocks and multiple inspection stations, which increases complexity and reduces throughput.
Innovation Solution
An apparatus with a mirror block having fixed and movable mirrors, allowing for flexible adjustment to accommodate various semiconductor device sizes without the need for new parts, combined with a camera that compensates for focal distance changes using linear movement or autofocus, enabling efficient and reliable inspection of all side faces in a single setup.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If custom mirror blocks are used for each semiconductor device size, then inspection accuracy is improved, but device complexity and cost increase
Solution Approach 1:
The patent implements a universal mirror block design that can inspect multiple semiconductor device sizes using the same optical components. The system uses a single mirror block with adjustable mirrors that can be positioned to accommodate different device dimensions, eliminating the need for custom mirror blocks for each device type while maintaining inspection accuracy
Solution Approach 2:
The patent employs dynamically adjustable mirrors within the mirror block that can be repositioned to adapt to different semiconductor device sizes. This dynamic adjustment capability allows the same mirror block to function for multiple device types, reducing complexity while preserving measurement precision through real-time optical path optimization
2Reliability
If multiple inspection stations are used to cover all side faces, then inspection completeness is improved, but productivity decreases
Solution Approach 1:
The patent merges the functionality of multiple inspection stations into a single integrated mirror block system. By combining multiple mirrors and optical paths within one station, the system can capture images of all four side faces simultaneously, maintaining inspection completeness while eliminating the need for multiple sequential stations, thereby improving throughput
Solution Approach 2:
The patent uses a tilted mirror to redirect the optical path from the mirror block to the camera at an angle, enabling the system to capture side face images that would otherwise require separate inspection stations. This dimensional redirection of the optical path allows comprehensive inspection within a single station, improving both completeness and productivity
3Device complexity
If a fixed optical system is used for inspection, then device complexity is reduced, but adaptability decreases
Solution Approach 1:
The patent implements movable mirrors within the mirror block that can be adjusted to accommodate different semiconductor device sizes and configurations. This dynamic adjustment capability provides flexibility to inspect various device types while maintaining a relatively simple overall system architecture, avoiding the need for completely different optical systems for each device type
Solution Approach 2:
The patent changes optical parameters such as mirror positions and angles to adapt to different semiconductor device sizes. By adjusting these parameters rather than changing the entire optical system, the patent achieves high adaptability while keeping device complexity low, as the same physical components can be reconfigured for different inspection needs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for cost-effective, flexible, and reliable inspection of a wide range of semiconductor device sizes without the need for custom parts or multiple stations, reducing costs and increasing inspection speed and accuracy.
Implementation Method 1
a mirror block, having a first mirror, a second mirror, a third mirror, and a fourth mirror, the mirrors being arranged such that they surround a free space in the form of a rectangle
Data Source
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Figure 3A~3C
Figure 4~5
AI summary
An apparatus, a method and a computer program product for inspecting at least side faces of a semiconductor device are disclosed. A frame construction is provided, which holds a camera, defining an imaging beam path. The semiconductor device is inserted into a mirror block. The mirror block has a first mirror, a second mirror, a third mirror and a fourth mirror, wherein the mirrors are arranged such that they surround a free space in the form of a rectangle. The opposing first mirror and third mirror are fixedly mounted and the opposing second mirror and fourth mirror movably mounted. A tilted mirror directs an image of the side faces of the semiconductor substrate generated by the mirror block to the camera.