Adjustable Nozzle Mask Glue Removal Apparatus
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Solution Overview
Problem
Current methods for removing cured glue from semiconductor masks are inefficient, often damaging the mask patterns and requiring frequent replacement, leading to increased production costs.
Innovation Solution
A mask glue removing apparatus and method featuring a first plate with adjustable nozzles that can be positioned to dispense chemical liquids and air precisely at independent angles to target and remove glue without affecting mask patterns, using a second plate that adjusts its position during the removal process to prevent chemical liquids and air from reaching the pattern surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a liquid chemical cleaning process is performed to remove cured glue from the mask, then the glue removal effectiveness is improved, but the mask patterns may be damaged and production cost increases
Solution Approach 1:
The patent applies local quality by directing cleaning liquids and air flows to specific locations on the mask surface where glue is present, rather than treating the entire mask uniformly. The adjustable nozzles allow precise positioning of cleaning agents only on the glue region, leaving the pattern areas protected from chemical exposure.
Solution Approach 2:
The cleaning process is segmented into multiple stages with different functions: chemical liquid application for glue removal, air blowing for drying and preventing liquid spread, and rinse application for residual removal. Each stage targets specific needs of the glue removal process while protecting the mask patterns through controlled, localized application.
2Reliability
If a liquid-reinforced chemical cleaning process is performed to remove glue more effectively, then the glue removal effectiveness is improved, but the mask patterns may be removed and pattern size may be changed
Solution Approach 1:
The system employs locally targeted cleaning by positioning nozzles to direct chemical liquids and air flows exclusively at the glue region. The adjustable nozzle angles and positions ensure that cleaning agents are confined to the glue area, preventing any contact with the mask patterns and thus preserving pattern dimensional accuracy.
Solution Approach 2:
Air flows are used as an intermediary medium to blow away chemical liquids and removed glue from the mask surface. This air blowing action prevents liquid chemicals from reaching the pattern areas, serving as a protective barrier that maintains pattern integrity while enabling effective glue removal.
3Measurement precision
If the head is moved close to the glue region and nozzles are adjusted at independent dispensing angles, then the precision of chemical liquid application is improved, but the device complexity increases
Solution Approach 1:
The system incorporates dynamic adjustability in the nozzle assembly, allowing the head to move closer to the glue region and the nozzles to be adjusted at independent dispensing angles. This dynamic configuration enables precise targeting of the cleaning agents at the glue location while maintaining the ability to adapt to different glue positions and orientations on the mask.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes glue from semiconductor masks without damaging the patterns, reducing the need for frequent mask replacements and lowering production costs by ensuring precise and controlled application of cleaning agents.
Implementation Method 1
dispense a chemical liquid, rinse, and air through the plurality of nozzles to remove the glue
Data Source
AI summary
A mask glue removing apparatus includes a first plate including a plurality of nozzles to be adjusted at independent dispensing angles of each other and a head in which the plurality of nozzles are installed and configured to move the head close to a position corresponding to a region of a mask in which glue is present, adjust the dispensing angles of the plurality of nozzles to face the region in which the glue is present, and dispense a chemical liquid, rinse, or air through the plurality of nozzles to remove the glue, and a second plate on which the mask is placed and configured to adjust a position of a main body according to a removal process for the glue.