Adjustable Nozzle Mount for Substrate Cleaning Uniformity
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Solution Overview
Problem
The existing chemical mechanical polishing (CMP) process faces challenges in achieving uniform etching across the substrate surface due to variations in spray distance and angle of chemicals, leading to significant deviations in etch rates between substrate regions close to and far from the nozzle.
Innovation Solution
The implementation of an adjustable nozzle mount that allows for precise control of the spraying angle of the spray nozzle, ensuring that chemicals are evenly applied to the substrate surface, thereby minimizing etch rate deviations and improving etching uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If chemicals are sprayed directly on the substrate surface, then the cleaning process can remove impurities, but the etch rate deviates significantly between substrate regions close to and far from the nozzle
Solution Approach 1:
The patent introduces a roller brush as an intermediary carrier between the spray nozzle and substrate. Chemicals are sprayed onto the roller brush surface, which then transfers them uniformly to the substrate during contact. This mediator approach eliminates direct spray-to-substrate contact, ensuring even chemical distribution across the entire substrate surface regardless of position relative to the nozzle.
Solution Approach 2:
The patent transitions from direct point-source spraying to a surface-based transfer mechanism. By spraying chemicals onto the rotating roller brush surface and then transferring them to the substrate through contact, the system adds a spatial dimension (the roller brush surface) that enables uniform distribution across the substrate area, eliminating position-dependent etch rate variations.
2Productivity
If the spray nozzle is positioned close to the substrate for efficient chemical application, then the cleaning effectiveness improves, but the etch rate deviation increases due to distance variations across the substrate
Solution Approach 1:
The roller brush serves as a mediator that decouples the spray nozzle position from the substrate treatment uniformity. The nozzle can be positioned optimally for efficient chemical application onto the roller brush, while the roller brush's rotation and contact with the substrate ensure uniform chemical transfer across the entire substrate surface, eliminating position-dependent etch rate variations.
Solution Approach 2:
The system performs preliminary chemical application onto the roller brush surface before the actual substrate cleaning. This two-stage process allows the chemicals to be evenly distributed on the roller brush first, which then transfers them uniformly to the substrate during contact, ensuring consistent etch rate across different substrate regions.
3Reliability
If the roller brush is frequently replaced to maintain cleaning quality, then the substrate cleaning performance is maintained, but the spray nozzle orientation may change affecting etching uniformity
Solution Approach 1:
The patent implements an adjustable nozzle mount that allows dynamic adjustment of the spray nozzle orientation. This enables operators to recalibrate the spray angle after roller brush replacement, ensuring consistent chemical application patterns and maintaining etching uniformity despite changes in the roller brush assembly.
Solution Approach 2:
The adjustable nozzle mount enables modification of the spray nozzle's angular parameters. By changing the spray angle parameter after roller brush replacement, the system compensates for any orientation changes and maintains consistent chemical distribution patterns, thereby preserving etching uniformity across substrate batches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively enhances etching uniformity by finely controlling the etch rate, eliminating the need for separate dilution devices and maintaining equipment performance even during frequent roller brush replacements.
Implementation Method 1
a spray nozzle configured to spray a chemical on the roller brush
Implementation Method 2
an adjustable nozzle mount that is coupled to the module body and selectively fixes the spray nozzle in a selectable orientation, wherein the adjustable nozzle mount controls an orientation of the spray nozzle to adjust a spraying angle of the spray nozzle
Implementation Method 3
the roller brush is configured to clean a substrate
Implementation Method 4
a process of planarizing a wafer surface by using chemical reactions and mechanical forces
Data Source
AI summary
A nozzle module according to an embodiment may include a module body extending in a first direction and configured to be spaced apart from a roller brush by a particular distance, wherein the roller brush is configured to clean a substrate, a spray nozzle configured to spray a chemical on the roller brush, and an adjustable nozzle mount that is coupled to the module body and selectively fixes the spray nozzle in a selectable orientation, wherein the adjustable nozzle mount controls an orientation of the spray nozzle to adjust a spraying angle of the spray nozzle.