Adjustable PCB-FPC Soldering Fixture for Multi-Board Assembly
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Solution Overview
Problem
Existing soldering devices can only solder and connect a single Flexible Printed Circuit (FPC) to a single Printed Circuit Board (PCB) at a time, resulting in low soldering efficiency.
Innovation Solution
A circuit board assembly soldering apparatus with multiple bearing seats, including at least one adjustable bearing seat, allows for the simultaneous soldering of multiple FPCs to multiple PCBs by adjusting the height of the workbenches to accommodate different thicknesses and ensuring proper pressure is applied.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single FPC is soldered to a single PCB at a time, then the soldering quality is ensured, but the soldering efficiency is low
Solution Approach 1:
The apparatus is divided into multiple independent bearing seats (first bearing seat, second bearing seat, etc.), each capable of holding and soldering a circuit board assembly independently. This segmentation allows parallel processing of multiple FPC-PCB connections simultaneously, thereby improving soldering efficiency while maintaining manageable device complexity through modular design
Solution Approach 2:
Multiple bearing seats are integrated into a single apparatus structure with a shared pressing plate assembly and control system. By merging multiple soldering stations into one unified device, the system achieves high productivity through simultaneous multi-point soldering while avoiding the complexity of managing separate independent apparatuses
2Adaptability or versatility
If the pressing plate assembly applies pressure to circuit board assemblies of different thicknesses, then soldering can be performed, but uneven pressure distribution may cause damage or poor soldering quality
Solution Approach 1:
The bearing seats are designed to be adjustable in height, allowing each seat to be dynamically positioned according to the thickness of the specific circuit board assembly being soldered. This dynamic adjustment capability enables the pressing plate assembly to maintain uniform pressure distribution across assemblies of varying thicknesses, ensuring consistent soldering quality and preventing damage from excessive or insufficient pressure
Solution Approach 2:
Each bearing seat can be independently adjusted to provide localized support at the appropriate height for its specific circuit board assembly. This local quality adjustment ensures that the pressing force is distributed evenly across each assembly's contact area, adapting to local thickness variations while maintaining overall soldering reliability
Data Source
AI summary
This application provides a circuit board assembly soldering apparatus and corresponding method. The soldering apparatus is provided with at least two bearing seats on a base plate, the bearing seats are located in a space between the base plate and a pressing plate assembly, the bearing seats each include a workbench, the workbench is located on a side of the bearing seat that faces the pressing plate assembly, a circuit board assembly is placed on the workbench. At least one adjustable bearing seat is provided, and a spacing between the workbench of the adjustable bearing seat and the base plate is adjustable. Further, a spacing between the workbench of the adjustable bearing seat and the pressing plate assembly is adjusted, to implement soldered connection between circuit board assemblies with different thicknesses, and the soldering apparatus can connect at least two circuit board assemblies by soldering at a single time.