Adjustable Support Pillar Array for Warped Semiconductor Panels
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Solution Overview
Problem
Panel warpage in semiconductor panel-level packaging poses challenges during manufacturing and assembly, leading to alignment issues and reduced yields due to factors like epoxy molding compound shrinkage, process-induced stresses, and thermal expansion mismatches.
Innovation Solution
A support assembly with height-adjustable support pillars that engage with dedicated landing pads on the semiconductor panel, allowing for individual vertical movement to compensate for warpage and maintain a level position during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If panel-level packaging is used to improve area utilization and reduce costs, then manufacturing efficiency and cost-effectiveness are improved, but panel warpage occurs due to epoxy molding compound shrinkage, process-induced stresses, and CTE mismatch
Solution Approach 1:
The support assembly employs height-adjustable support pillars that can be individually positioned to compensate for panel warpage. The adjustable mechanism allows the system to dynamically adapt to varying panel geometries and warpage conditions, maintaining stable support despite changes in panel shape during manufacturing processes.
Solution Approach 2:
The support pillars feature adjustable height parameters that can be modified to match the specific warpage profile of each panel. By changing the height parameter of individual support pillars, the system compensates for non-uniform panel deformation caused by epoxy shrinkage and thermal expansion mismatches.
2Area of stationary object
If larger panels are used to increase area utilization ratio, then material cost is reduced, but handling capability of processing tools deteriorates due to excessive warpage
Solution Approach 1:
The support assembly divides the large panel into multiple supported regions through an array of individually adjustable support pillars. Each pillar independently supports a local region of the panel, allowing the entire large panel to be stabilized despite its size and associated warpage issues.
Solution Approach 2:
Each support pillar provides localized support with independently adjustable height, allowing precise compensation for local warpage variations across the large panel. This local adjustment capability enables handling of oversized panels that would otherwise be difficult to process due to global warpage.
3Device complexity
If panel warpage is not compensated, then device complexity is reduced, but alignment precision and yield deteriorate during assembly operations
Solution Approach 1:
The support assembly automatically compensates for panel warpage through its adjustable support pillars, eliminating the need for complex external alignment systems. The self-adjusting nature of the support pillars provides precise panel positioning without requiring additional complex alignment equipment or procedures.
Data Source
AI summary
A semiconductor tool having a support assembly for holding a semiconductor panel in a level position during an assembly process is able to remediate the warpage that may be present in the semiconductor panel. The support assembly may be equipped with a plurality of height-adjustable support pillars in the form of an array that is positioned below the semiconductor panel to provide a level position. The support pillars may be activated by a controller to engage or land on dedicated landing features or pads formed on the semiconductor panel or on suitable landing features that may be found in a semiconductor design layout and provide a dual use.