Adjustable-Pitch Pick-Up Head Arrays for Precise Chip Bonding
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Solution Overview
Problem
Advanced packaging technologies face challenges in achieving high throughput while maintaining precise chip placement, particularly in hybrid bonding where small misalignment tolerances are difficult to meet, with single-chip transfer techniques offering high precision but low throughput and multi-chip transfer techniques struggling with precise placement.
Innovation Solution
An apparatus comprising a source chuck, an array of pick-up heads with adjustable pitch, an array of bonding heads, and a product chuck, allowing the pick-up heads to reversibly change pitch between source-matching and bonding head-matching pitches, enabling high-throughput chip transfer and bonding while maintaining alignment specifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multi-chip transfer technique is used, then throughput is improved, but manufacturing precision deteriorates
Solution Approach 1:
The transfer process is segmented into multiple independent transfer cycles, where arrays of pick-up heads and bonding heads operate simultaneously to transfer multiple chips in parallel. Each head operates independently but coordinates through the shared pitch adjustment mechanism, achieving high throughput while maintaining precision through divided operational units.
Solution Approach 2:
The pitch of the pick-up heads is made dynamically adjustable during operation, allowing reversible changes between source-matching pitch and bonding head-matching pitch. This dynamic adaptation enables the system to maintain precise alignment for different transfer stages while operating in high-throughput multi-chip mode.
2Adaptability or versatility
If pitch adjustment is performed during transfer cycle, then adaptability is improved, but device complexity increases
Solution Approach 1:
The pick-up heads are designed with universal pitch adjustment capability, allowing the same array of heads to operate at different pitches (source-matching and bonding head-matching) without requiring separate dedicated heads for each function. This multi-functionality reduces overall system complexity while maintaining high adaptability.
Solution Approach 2:
The pitch adjustment mechanism is designed to be dynamically reversible during the transfer cycle, allowing the system to switch between different pitch configurations on-the-fly. This dynamic capability enables adaptability to different transfer requirements without adding permanent complex structures for each configuration.
Data Source
AI summary
An apparatus can include a source chuck, an array of pick-up heads, an array of bonding heads, and a product chuck. The source chuck can have a source holding surface facing a first direction. The array of pick-up heads can have pick-up surfaces facing a second direction opposite the first direction and configured to have an adjustable pitch that can be reversibly changed between a source-matching pitch and a bonding head-matching pitch. The array of bonding heads can have holding surfaces facing the first direction and configured to be at a bonding head pitch. The product chuck can have a product holding surface facing the second direction. The apparatus can be used to transfer chips from a source substrate to a product substrate and bond the chips to product bonding sites of the product substrate.